Taiwan PCB leaders launch fundraising wave for AI data centers

The fundraising surge by PCB leaders in Taiwan, China reflects a defensive move amid the AI infrastructure arms race. Rising technical barriers in HDI and ABF substrates are forcing upstream material suppliers—like TUC and Nan Ya Plastics—to adopt low-Dk resins and ultra-thin copper foils. However, U.S. CHIPS Act restrictions on advanced packaging and Japan’s tightened export controls have extended critical material lead times by 15–20%, inflating compliance costs. Competitors like Samsung Electro-Mechanics and Ibiden are aggressively capturing North American CoWoS substrate orders. If Taiwanese firms fail to qualify secondary Southeast Asian supply chains with UL/IPC certifications within 18 months, their global market share could drop below 60% from today’s 68%, triggering consolidation.