The Materials That Make Power Electronics Work

This article focuses on the critical role of materials in power electronics, especially as trends such as electric vehicles, AI data centers, and industrial electrification drive increasing demands fo... Read original →

Advanced materials are transitioning from enablers to primary bottlenecks in power electronics. The adoption of silicon carbide devices demands interconnect and thermal interface solutions that exceed conventional limits in conductivity and reliability. While silver sintering offers performance, its cost drives R&D toward copper alternatives—despite oxidation challenges. Henkel and peers are racing to lock in next-gen standards via pressure-assisted sintering and surface engineering. This shift pressures upstream metal powder suppliers and forces module assemblers in Taiwan, China and mainland China to redesign thermal architectures amid rising compliance costs from U.S.-EU reshoring policies. Within 18 months, AI data centers’ surging demand for high-power-density modules will accelerate commercialization of copper sintering and novel TIMs, granting first-movers control over SiC ecosystem pricing.