TSMC delays CoWoS orders as CoPoS plans take shape

TSMC's delay in CoWoS equipment orders signals a strategic realignment in advanced packaging. Technologically, this impacts upstream suppliers of EUV tools and packaging equipment, causing capital expenditure delays, while downstream demand for AI chips remains strong but increasingly demands higher-end packaging capabilities. From a compliance standpoint, the intensifying U.S.-China tech decoupling forces TSMC to balance expansion with supply chain localization, especially under export controls affecting Taiwan, China and U.S. regulations. Competitors like Samsung and UMC may accelerate their own CoPoS strategies to gain market share. Looking ahead, the 2025–2027 packaging roadmap will shift significantly, and TSMC risks losing ground if it fails to integrate CoWoS and CoPoS efficiently.