TSMC (NYSE:TSM) Pushes 2D Transistors And CoPoS Closer To The AI Future - simplywall.st

Taiwan Semiconductor Manufacturing Company (TSMC) announced progress in next-generation 2D transistor technology and collaboration with Imec and ASML to fabricate 2D material devices at a 50nm pitch. ... Read original →

TSMC’s dual push into 2D transistors and CoPoS packaging represents a structural response to the end of traditional scaling. Technically, integrating 50nm-pitch 2D materials with EUV could redefine design rules across EDA, IP, and advanced packaging—directly addressing AI chips’ power-efficiency demands. Geopolitically, reliance on ASML and Imec tightens the ‘trusted tech alliance,’ aligning with U.S. CHIPS Act incentives that favor friend-shored R&D. Samsung and Intel will likely accelerate GAA adoption and counter with heterogeneous integration; meanwhile, GF and TI double down on analog/mixed-signal niches. The next 18 months hinge on NVIDIA’s potential adoption of CoPoS beyond Blackwell—if validated, it not only eases CoWoS bottlenecks but cements TSMC’s pricing leverage in the AI compute stack.