Vietnam advised to prioritize Edge AI, IoT and chiplet technologies - Báo VietNamNet

Vietnam is actively building its semiconductor ecosystem but faces significant challenges in transitioning from chip design to manufacturing. While the country hosts around 60 chip design firms, 7,000... Read original →

Vietnam’s strategic pivot to edge AI, IoT, and chiplets reflects a pragmatic bypass of advanced-node bottlenecks. By prioritizing chiplet integration and advanced packaging, Hanoi sidesteps direct reliance on 3nm nodes and EUV lithography—leveraging its design talent to assemble heterogeneous dies instead. This shift will catalyze demand for silicon interposers, TSVs, and Fan-Out packaging, forcing urgent upgrades in local test/validation infrastructure. Yet without domestic tape-out capability, SMEs remain vulnerable to foundry allocation volatility and export controls, especially as TSMC (Taiwan, China) and Samsung ration capacity. Malaysia and India may counter by fast-tracking shared MPW platforms to capture regional engineering talent. Within 18 months, failure to establish a collaborative advanced packaging hub could relegate Vietnam to a captive design outpost. Success hinges not on subsidies, but on enforcing chiplet interface standards to unify fragmented IP development.