Industry Analysis
The AI infrastructure boom is triggering a deep reconfiguration of the semiconductor stack. AMD’s chiplet-based CPUs and GPUs are capturing inference workloads by reducing reliance on leading-edge nodes and eroding NVIDIA’s edge-AI dominance. Meanwhile, Broadcom’s hyperscaler-custom ASICs—like those with Google—bypass GPU ecosystem lock-in by targeting power efficiency directly. Escalating U.S. export controls compel accelerated supply chain localization; while TSMC’s overseas fabs in the U.S., Japan, and Europe mitigate some risk, restricted access to EUV tools will inflate advanced packaging costs. NVIDIA may be forced to open CUDA interfaces to defend its moat. Over the next 12–24 months, chip design will shift from 'peak performance' to 'optimal for workload,' accelerating heterogeneous integration and tighter hardware-software co-design—with critical roles for packaging and IP hubs in Taiwan, China and Hong Kong, China.
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