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2026-09-23
Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset
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digitimes.com
2026-09-23
2026-09-10
Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers - Yahoo Finance Singapore
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2026-09-10
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