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Socionext taps Intel 18A-P process for high-performance compute chiplet development - digitimes

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www.digitimes.com 2026-08-19

Intel closes out RAMP-C production pilot that paid Nvidia and others to run test chips on 18A — program helped lay a path for secure domestic chip production on advanced processes - Tom's Hardware

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www.tomshardware.com 2026-07-29

Intel has concluded the RAMP-C (Reliable Advanced Manufacturing for Competition) production pilot program, a U.S. government initiative launched in 2021 to establish a secure, domestic advanced chip ecosystem. The program enabled commercial and defense partners, including NVIDIA, Microsoft, and IBM,

Intel Semiconductor Manufacturing U.S. Chip Policy RAMP-C Program Secure Enclave Defense Chips 18A Process Chip Supply Chain

Intel closes out RAMP-C production pilot that paid Nvidia and others to run test chips on 18A

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tomshardware.com 2026-07-29

Intel has concluded the RAMP-C production pilot program, a U.S. government initiative launched in 2021 to establish a secure, domestic leading-edge chip ecosystem using its 18A process node. The program supported commercial and defense partners in testing chips on incomplete design kits, generating

Intel NVIDIA Semiconductor Manufacturing 18A Process RAMP-C Program US Government Funding Secure Enclave Chip Design

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A - HPCwire

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www.hpcwire.com 2026-07-29

Cadence's certification of AI-driven reference flows for Intel's 18A-P and 14A process technologies represents a significant advancement in semiconductor manufacturing and AI chip design. These advanced process nodes, at 18nm and 14nm respectively, provide the foundation for high-performance computi

Semiconductor Manufacturing AI Chip Design Reference Flow Certification Intel Process Technology Cadence Chip Design Tools High Performance Computing Advanced Process

Cadence certifies AI reference flows for Intel 18A-P and 14A technologies - Electronics Weekly

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news.google.com 2026-07-29

Cadence certifies AI-driven design flows for Intel 18A-P and 14A process technologies - New Electronics

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news.google.com 2026-07-28

Intel 18A-P and 14A gain Cadence’s full EDA toolchain, tightening the ecosystem push to challenge TSMC’s foundry lead - Wccftech

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news.google.com 2026-07-27

Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A - TechPowerUp

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news.google.com 2026-07-27

Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties - digitimes

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news.google.com 2026-07-27

Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties - digitimes

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news.google.com 2026-07-27

Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties

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digitimes.com 2026-07-27

Intel 18A adopts High-NA EUV in dual-certification push - digitimes

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www.digitimes.com 2026-07-23

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV

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tomshardware.com 2026-07-21

Recent teardown analysis by SemiAnalysis of Huawei's Kirin 9030 chip revealed that SMIC's third-generation 7nm process (N+3) achieves a smaller metal pitch than Intel's 18A and surpasses TSMC's N6 in transistor density, despite not using EUV lithography. However, this does not make SMIC's N+3 proces

SMIC TSMC Intel Semiconductor Process 7nm Technology Metal Pitch Transistor Density EUV Lithography

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing - Tom's Hardware

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www.tomshardware.com 2026-07-21

Kirin 9030 In-Depth Analysis Proves SMIC Can Create Denser SoCs Than Intel Has With Its 18A Node, But The Attributes That Require Improvements Are Left Out - Wccftech

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wccftech.com 2026-07-21

Intel's 18A Process Beats TSMC to High-NA EUV Mass Production, Opening a New Chapter in Advanced Node Rivalry - finance.biggo.com

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finance.biggo.com 2026-07-17

The global semiconductor advanced process competition has reached a critical turning point. Intel has successfully integrated High-NA Extreme Ultraviolet (EUV) lithography into its 18A process, enabling mass production of its Core Ultra Series 3 processors, marking the world's first commercial appli

Semiconductor Process EUV Lithography Advanced Node Intel TSMC ASML High-NA EUV Chip Manufacturing

Intel cuts planned TSMC 2nm orders for Nova Lake processors as 18A advances - Taiwan News

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www.taiwannews.com.tw 2026-07-16

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners - Tom's Hardware

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www.tomshardware.com 2026-07-15

ASML reports Intel Foundry is using High NA EUV technology on 18A process node - TipRanks

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www.tipranks.com 2026-07-15

ASML’s High NA EUV tech enters volume production with Intel 18A - OC3D

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overclock3d.net 2026-07-15

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