biz.chosun.com
2026-06-30
Chosunbiz
By
Jeong Du-yong
Published 2026.06.30. 15:27
Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor
HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly