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2026-07-09

As AI Moves from Training to Inference, Optics Moves Closer to the Chip

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eetimes.com 2026-07-09

Imec researchers argue that co-packaged optics will not be enough for future AI systems, pushing the industry toward 2.5D and eventually 3D optical I/O.

Artificial Intelligence Chip Design Optical Interconnect AI Inference GPU Communication Optical Modules 3D Optical I/O Silicon Photonics