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2026-09-01
China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
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2026-09-01
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SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
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China Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip Substrates - Pandaily
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