Semiconductor News & Analysis Feed

Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so they can build the extremely complex 3D architectures necessary for the next generation of artificial intelligence processors. To do this, it has unveiled a host of new chip fabrication systems that span advanced packaging, process control and dynamic-random access memory m

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.