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China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips - digitimes

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news.google.com 2026-07-06 digitimes

China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

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digitimes.com 2026-07-06

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.

SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal

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eetimes.com 2026-06-24

Synopsys debuts Multiphysics Fusion tools post-Ansys, unifying EDA and physics for advanced node and 3DIC designs.

Semiconductor Design EDA Tools Multiphysics Simulation Ansys Acquisition Chip Design Flow Advanced Node Thermal Analysis EMI/EMC

Synopsys’ 3DIC Push: Can Advanced Chip Complexity Fuel The Next Leg? - Smartkarma

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www.smartkarma.com 2026-06-07 Smartkarma

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3DIC technology chip design semiconductor supply chain EDA tools advanced process chip complexity technological innovation semiconductor equipment

Synopsys and Samsung Foundry Expand AI-Driven Design, Test, and 3DIC Enablement for Advanced Nodes - EE Times Asia

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news.google.com 2026-06-03 EE Times Asia

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