SemiPulse — Semiconductor Intelligence

AI boom drives Taiwan's semiconductor testing industry into record expansion

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digitimes.com 2026-05-11

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test (OSAT) industry is entering what executives and analysts describe as an unprecedented expansion cycle. Industry observers estimate that combined capital expenditures by Taiwanese OSAT providers could surge to a record NT$400 billion (approx. US$12.7 billion) in

AMD's 2nm defection to Samsung dents TSMC's AI grip

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digitimes.com 2026-05-11

The AI semiconductor supply chain is showing unexpected signs of a shift, with TSMC's long-held dominance in the foundry market beginning to loosen. US chipmakers are increasingly engaging with Samsung Electronics and Intel as alternative suppliers, and AMD has already handed its 2nm order to Samsung.

DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

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digitimes.com 2026-05-11

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook.

TrendForce Sees Tightening Advanced Packaging and 3nm Capacity as AI Competition Turns Into a Supply Chain Arms Race - EE Times Asia

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news.google.com 2026-05-11 EE Times Asia

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SÜSS MicroTec SE stock: Semiconductor equipment maker eyes growth in advanced packaging and lithogr - AD HOC NEWS

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www.ad-hoc-news.de 2026-05-09 AD HOC NEWS

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Global Semiconductor Packaging Market to Exceed $618 Billion in 2026, KPCA Says - thelec.net

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www.thelec.net 2026-05-09 thelec.net

1Samsung Display, LG Display to Supply OLED Panels for Apple iPhone 18 Pro Models2Bezos-Backed Prometheus Startup Raises $10 Billion Without a Prototype3DRAM Prices Seen Rising Up to 48% in Q2 as Pace of Gains Slows4SK hynix Says Hybrid Bonding HBM Yield Improved5Qualcomm to Ship First Data-Center Chips This Year6Galaxy S26 Ultra Uses Qualcomm Snapdragon 8 Elite 5th Gen7Samsung Electronics Targets

Semiconductor Packaging Market Forecast KPCA OLED Panels Apple iPhone DRAM Prices SK Hynix HBM

Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - The Globe and Mail

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www.theglobeandmail.com 2026-05-08 The Globe and Mail

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Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - Yahoo! Finance Canada

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ca.finance.yahoo.com 2026-05-08 Yahoo! Finance Canada

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Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - Yahoo Finance

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finance.yahoo.com 2026-05-08 Yahoo Finance

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Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - Zacks Investment Research

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www.zacks.com 2026-05-08 Zacks Investment Research

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Does Applied Materials’ NEXX Deal and AI Packaging Push Reshape the Bull Case for AMAT? - simplywall.st

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simplywall.st 2026-05-08 simplywall.st

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Kenyi bets on Arm AGI CPU and chiplets to reshape edge telecom infrastructure - The Mobile Network

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the-mobile-network.com 2026-05-08 The Mobile Network

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Malaysia to develop advanced semiconductor packaging capability in 2 years - Free Malaysia Today

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www.freemalaysiatoday.com 2026-05-08 Free Malaysia Today

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Honor Magic 9 Pro Max to use 2nm flagship chip + dual 200MP cameras - Huawei Central

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www.huaweicentral.com 2026-05-08 Huawei Central

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TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead - digitimes

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www.digitimes.com 2026-05-08 digitimes

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources...The article requires paid subscription.Subscribe Now

TSMC CoPoS Advanced Packaging AI Semiconductors Semiconductor Manufacturing CoWoS EUV Lithography Chip Packaging

Govt bets on five local semiconductor companies to capture 7% of the global advanced packaging market by 2035 - The Edge Malaysia

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theedgemalaysia.com 2026-05-08 The Edge Malaysia

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Govt bets on five local semiconductor companies to capture 7% of the global advanced packaging market by 2035 - The Edge Malaysia

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theedgemalaysia.com 2026-05-08 The Edge Malaysia

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Govt bets on five local semiconductor companies capturing 7% of global advanced packaging market by 2035 - KLSE Screener

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www.klsescreener.com 2026-05-08 KLSE Screener

KUALA LUMPUR (May 8): The Malaysian government has provided RM92 million in research and development (R&D) grants to five local companies that form the Malaysia Advanced Packaging Consortium (MAPC) to help upgrade the country’s semiconductor industry into a higher-value sector, according to the Ministry of Science, Technology and Innovation (Mosti).The funding, channelled through the Malaysia Sci

Semiconductor Industry Advanced Packaging Malaysian Government R&D Investment Technology Policy Artificial Intelligence Supply Chain Resilience High-Value Manufacturing

MOSTI pushes Malaysia towards high-value semiconductor future with advanced packaging drive - The Vibes

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www.thevibes.com 2026-05-08 The Vibes

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KLIC Q1 Deep Dive: Accelerating Demand and Advanced Packaging Expansion Drive Outlook - StockStory

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stockstory.org 2026-05-08 StockStory

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