Semiconductor News & Analysis Feed
609 articles
2026-06-24
pulse2.com
2026-06-24
Pulse 2.0
Qnity Electronics announced the launch of its Advanced Packaging Innovation Hub, a new online platform showcasing the company’s material and technology solutions for advanced packaging.
The launch highlights advanced packaging as a strategic growth driver and innovation priority for Qnity. The company said its solutions are designed to support next-generation artificial intelligence, high-perform
2026-06-24
www.insidermonkey.com
2026-06-24
Insider Monkey
NEWS
Why ASMPT Limited’s (ASMVY) Repeat TCB Tool Order Deepens Its Role in HBM and AI Packaging
Published on June 23, 2026 at 12:10 pm by HABIB UR REHMAN in News
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ASMPT Limited (OTC:ASMVY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company sharpened its HBM relevance on June 8, 2026, when it announced a repeat order for eight chip-to-wafer Thermo-Compression Bondi
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
How BE Semiconductor Industries (BESIY) Is Turning Hybrid Bonding Demand Into a Bigger AI Packaging Growth Target
Habib Ur Rehman
Tue, June 23, 2026 at 9:10 AM PDT 2 min read
BESI.AS
-0.37%
BE Semiconductor Industries N.V. (OTC:BESIY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company strengthened its HBM-adjacent case on June 18, 2026, when it raised its long-term rev
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
Why ASMPT Limited’s (ASMVY) Repeat TCB Tool Order Deepens Its Role in HBM and AI Packaging
Habib Ur Rehman
Tue, June 23, 2026 at 9:10 AM PDT 1 min read
0522.HK
+3.13%
ASMPT Limited (OTC:ASMVY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company sharpened its HBM relevance on June 8, 2026, when it announced a repeat order for eight chip-to-wafer Thermo-Compression Bondin
2026-06-24
www.marketscreener.com
2026-06-24
marketscreener.com
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2026-06-23
www.manilatimes.net
2026-06-23
The Manila Times
Production-ready 3DI technology supports more compact FEMs for advanced 5G devices
MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-pe
2026-06-23
gf.com
2026-06-23
GlobalFoundries
gf.com
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2026-06-23
www.moomoo.com
2026-06-23
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2026-06-23
finimize.com
2026-06-23
Finimize
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2026-06-23
digitimes.com
2026-06-23
Google released a 30,000-word AI roadmap on June 14 that, for the first time, clearly defines AI having the capability of 100 million humans as a key milestone on the path to artificial superintelligence (ASI). The plan outlines a three-stage evolution from today's large models to artificial general intelligence (AGI) and then ASI, reinforcing expectations that AI capabilities will keep expanding
2026-06-23
digitimes.com
2026-06-23
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing applications in advanced packaging, optical transmission and third-generation semiconductors. The rollout covers simultaneous construction and capacity ramp projects at Erlin, Zhengzhou, and Zhunan to align production
2026-06-23
digitimes.com
2026-06-23
Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.
2026-06-23
digitimes.com
2026-06-23
Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting in July 2026, with an average price increase of more than 30%. Affected products include helium used in key applications such as semiconductor front-end process wafer cooling and medical magnetic resonance imaging (MRI) equipment. The move is mainly driven by geo
2026-06-23
www.investing.com
2026-06-23
Investing.com
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2026-06-23
ca.investing.com
2026-06-23
Investing.com Canada
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2026-06-23
www.streetinsider.com
2026-06-23
StreetInsider
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2026-06-23
www.marketscreener.com
2026-06-23
marketscreener.com
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2026-06-23
www.lincolnjournal.com
2026-06-23
lincolnjournal.com
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Jun 22, 2026 Updated 1
2026-06-23
news.google.com
2026-06-23
Business Wire
2026-06-23
sg.finance.yahoo.com
2026-06-23
Yahoo Finance Singapore
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Business Wire
Mon, 22 June 2026 at 1:30 pm GMT-7 2 min read
Q
-8.23%
Qnity’s material innovations enable next-generation advanced packaging, showcased through new Innovation Hub
WILMINGTON, Del., June 22, 2026--(BUSINE