Semiconductor News & Analysis Feed

10799 articles
2026-06-16
www.mk.co.kr 2026-06-16 매일경제
Preemptive response to a 7-fold jump in memory values Set-top box costs also doubled Funding first-time carrier materials purchases "Prevent supply chain disruptions and stabilize supply chains" 사진 확대 The manufacturing site of KT's set-top box partner. KT As demand for high-bandwidth memory (HBM) for artificial intelligence (AI) servers has soared, the price of general-purpose memory in set-top b
2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
Infineon’s, Two-Pronged Infineon’s Two-Pronged Growth Bet: Humanoid Robots and AI Power Grids Fuel Rally 16.06.2026 - 07:51:18 | boerse-global.de Infineon rides humanoid robotics and AI power waves, shares up 111% YTD. GaN tech for robots, SiC modules for data centers. Guidance raised, market cap over €100B. Infineon’s - Infineon’s Two-Pronged Growth Bet: Humanoid Robots and AI Power Grids Fuel
2026-06-16
news.google.com 2026-06-16 EE Times Asia
2026-06-16
seekingalpha.com 2026-06-16 Seeking Alpha
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2026-06-16
www.tweaktown.com 2026-06-16 TweakTown
US AI startup Tensordyne claims 3nm Napier chip outperforms NVIDIA Blackwell by 13x in tokens per second The TDN72 rack houses 288 Napier chips, delivers 608 petaflops of FP8 compute, and claims to match the throughput of nine NVIDIA Rubin plus Groq LPX racks. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published Jun 16, 2026 12:15 AM CDT 1 minute & 45 seconds read time TL;DR: Tensordyne's 3nm N
2026-06-16
www.benzinga.com 2026-06-16 Benzinga
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2026-06-16
www.cnbc.com 2026-06-16 CNBC
Qualcomm is working on over 40 designs of new AI devices, CEO Cristiano Amon told CNBC, as the chip designer prepares for a wave of “agents” across consumer electronics. In a wide-ranging interview on CNBC’s “The Tech Download” podcast, Amon laid out his views on the changing role of smartphones and apps, why smart glasses could be the next major consumer device, new types of electronics that wi
2026-06-16
www.cnbc.com 2026-06-16 CNBC
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2026-06-16
drrobertcastellano.substack.com 2026-06-16 Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
AI Is No Longer Limited by Transistors. It Is Becoming Limited by Package Area DR. ROBERT CASTELLANO JUN 16, 2026 ∙ PAID 9 Share What’s In This Article The Next AI Bottleneck Has Arrived Chart 1. CoWoS and CoPoS Cost Crossover Why CoWoS Is Reaching Its Limits Table 1. Evolution of TSMC Advanced Packaging Technologies CoPoS Expands Package Area by More Than 5x Table 2. CoWoS Versus CoPoS Panel-Leve
2026-06-16
evertiq.com 2026-06-16 Evertiq
© Air Liquide Electronics Production | June 16, 2026 Air Liquide invests €200M in Korea to back SK hynix’s AI chip project Evertiq In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit. France’s Air Liquide has signed a long-term contract with SK hynix.
2026-06-16
seekingalpha.com 2026-06-16 Seeking Alpha
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2026-06-16
finance.yahoo.com 2026-06-16 Yahoo Finance
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions Simply Wall St Mon, June 15, 2026 at 8:20 PM PDT 2 min read QCOM -3.05% Trade QCOM on Coinbase Trading disclosure Find winning stocks in any market cycle. Join 7 million investors using Simply Wall St's investing ideas for FREE. Qualcomm, ticker NasdaqGS:QCOM, is reportedly in talks to acquire AI chip startup Tenstorrent
2026-06-16
www.msn.com 2026-06-16 MSN
Elon Musk’s SpaceX went public on Friday, exploding onto the scene with a valuation that quickly eclipsed $2 trillion. Things went swimmingly for a while, with shares steadily rising from a debut $150 — a premium of 11 percent over the original asking price — on Friday to well over $200 on Tuesday. But after peaking at $222 Tuesday morning, SpaceX started its first sustained decline of its nascen
2026-06-16
news.google.com 2026-06-16 EE Times Asia
2026-06-16
www.digitimes.com 2026-06-16 digitimes
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me si
2026-06-16
www.barchart.com 2026-06-16 Barchart.com
NVIDIA Corp logo outside building-by BING-JHEN_HONG via iStock Nvidia (NVDA) is back in the bond market for the first time in five years, and the size of the deal is getting attention. The chipmaker is seeking to raise at least $20 billion, with reports saying the final sale could reach $25 billion after strong demand pushed orders to about $85 billion. Nvidia says the proceeds will go toward gen
2026-06-16
www.bdtonline.com 2026-06-16 Bluefield Daily Telegraph
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2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
ASE Tech, TW0003711008 New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips 16.06.2026 - 03:43:12 | ad-hoc-news.de ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers. AS
2026-06-16
www.moomoo.com 2026-06-16 Moomoo
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2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
Infineon, DE0006231004 New AI power push: Infineon’s XDP700 digital multiphase controllers target Nvidia MGX servers 16.06.2026 - 03:15:46 | ad-hoc-news.de Infineon is sharpening its AI hardware focus with the XDP700 family of digital multiphase controllers, designed to deliver efficient, tightly regulated power to GPUs and accelerators in next-generation Nvidia MGX AI server platforms. Infineon