Semiconductor News & Analysis Feed
10630 articles
2026-07-14
digitimes.com
2026-07-14
Reports that Meta is considering leasing out idle AI computing capacity have rattled investors. But treating Meta's predicament as a warning sign for the entire AI industry is a classic case of overgeneralization.
2026-07-14
digitimes.com
2026-07-14
The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects through higher costs, delayed capacity, and uneven access to advanced processors. As demand for CPUs, GPUs, and ASICs rises, ABF substrate supply is tightening, and the squeeze is expected to last for years.
2026-07-14
digitimes.com
2026-07-14
Intel is doubling down on Ireland as the anchor of its European manufacturing base, committing EUR5 billion (US$5.7 billion) to expand its Leixlip campus barely a year after scrapping far larger fab projects in Germany and Poland. The move signals that, under a turnaround intended to align capacity with real demand, the chipmaker sees consolidated, upgraded capacity in a proven site — rather than
2026-07-14
digitimes.com
2026-07-14
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing. The latest sales data suggest the upgrade cycle is broadening beyond one segment, with advanced ABF substrates and high-end CCL benefiting from higher specifications, better pricing, and rising AI content. For inves
2026-07-14
digitimes.com
2026-07-14
US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on his goal of raising the US share of the global chip market to 50% before the end of his term. TSMC declined to comment on the report, but investors may press the company on the issue at its second-quarter 2026 earnings call.
2026-07-14
digitimes.com
2026-07-14
Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better power efficiency are becoming essential for AI inference, cloud computing, and HPC platforms used by businesses and consumers worldwide.
2026-07-14
digitimes.com
2026-07-14
Taiwan's silicon foundry industry posted a strong performance in June 2026, with aggregate revenue reaching US$15,131.2 million, up 5.9% from May and 54.0% from a year earlier — underscoring the sector's continued ride on AI and advanced-node chip demand.
2026-07-14
digitimes.com
2026-07-14
Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou
2026-07-14
digitimes.com
2026-07-14
Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new o
2026-07-14
digitimes.com
2026-07-14
Liying said revenue reached a quarterly record of NT$108 million in the second quarter of 2026, crossing the NT$100 million (US$3.11 million) mark for the first time as strong demand for AI chips kept semiconductor utilization rates high. The company also reported record first-half revenue of NT$206 million, reflecting continued demand for its circular-economy services tied to waste hydrofluoric a
2026-07-14
digitimes.com
2026-07-14
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
2026-07-14
digitimes.com
2026-07-14
The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation AI infrastructure.
2026-07-14
digitimes.com
2026-07-14
C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment demand. The PCB and semiconductor equipment maker said the outlook remained positive as foundry, outsourced semiconductor assembly and test, IC substrate, and high-end multilayer board customers increased capital
2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
Yahoo Finance
2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
Bloomberg.com
2026-07-14
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2026-07-14
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