Semiconductor News & Analysis Feed
3847 articles
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are...
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2026-06-16
www.infoworld.com
2026-06-16
InfoWorld
Nvidia’s RTX Spark paints a future in which AI agents and locally tuned language models live on the laptop in your backpack.
Credit: ViDI Studio/Shutterstock.com
Nvidia’s new RTX Spark is one of the most interesting personal computing announcements in years. That’s because it’s not just another PC platform, but tries to redefine the role of the personal computer in the age of AI. Announced at Co
2026-06-16
www.msn.com
2026-06-16
MSN
Record-breaking raise: Nvidia secured $25 billion in bonds, its largest debt deal ever, after orders more than tripled the offering size.
Strategic financing: Beyond refinancing debt, Nvidia aims to set a liquid credit benchmark to ease future borrowing amid AI market expansion.
AI capital race: The sale aligns with big tech's $700B AI spending push, positioning Nvidia as a key player in the sec
2026-06-16
astanatimes.com
2026-06-16
The Astana Times
BY AIDA HAIDAR in EDITOR’S PICKS, INTERNATIONAL on 16 JUNE 2026
ASTANA — Kazakhstan signed $10 billion worth of agreements with the United States AI infrastructure company Firebird and technology leader NVIDIA to develop large-scale artificial intelligence infrastructure, marking one of the country’s most ambitious technology investments to date.
The agreements, signed following a June 16 meetin
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor...
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2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Lam Research, US5128071082
AI wafer demand lifts Lam Research’s Sense.i platform into the spotlight
16.06.2026 - 10:44:18 | ad-hoc-news.de
Lam Research’s Sense.i etch platform is emerging as one of the key workhorses for high-aspect-ratio 3D NAND and advanced logic, as chipmakers ramp AI data center capacity and high-bandwidth memory. The modular system targets lower cost per wafer and tighter pr
2026-06-16
news.google.com
2026-06-16
TradingView
2026-06-16
news.google.com
2026-06-16
digitimes
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Infineon’s, Two-Pronged
Infineon’s Two-Pronged Growth Bet: Humanoid Robots and AI Power Grids Fuel Rally
16.06.2026 - 07:51:18 | boerse-global.de
Infineon rides humanoid robotics and AI power waves, shares up 111% YTD. GaN tech for robots, SiC modules for data centers. Guidance raised, market cap over €100B.
Infineon’s - Infineon’s Two-Pronged Growth Bet: Humanoid Robots and AI Power Grids Fuel
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
__fail__
2026-06-16
www.tweaktown.com
2026-06-16
TweakTown
US AI startup Tensordyne claims 3nm Napier chip outperforms NVIDIA Blackwell by 13x in tokens per second
The TDN72 rack houses 288 Napier chips, delivers 608 petaflops of FP8 compute, and claims to match the throughput of nine NVIDIA Rubin plus Groq LPX racks.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published Jun 16, 2026 12:15 AM CDT
1 minute & 45 seconds read time
TL;DR: Tensordyne's 3nm N
2026-06-16
www.cnbc.com
2026-06-16
CNBC
Qualcomm
is working on over 40 designs of new AI devices, CEO Cristiano Amon told CNBC, as the chip designer prepares for a wave of “agents” across consumer electronics.
In a wide-ranging interview on CNBC’s “The Tech Download” podcast, Amon laid out his views on the changing role of smartphones and apps, why smart glasses could be the next major consumer device, new types of electronics that wi
2026-06-16
www.cnbc.com
2026-06-16
CNBC
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2026-06-16
drrobertcastellano.substack.com
2026-06-16
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
AI Is No Longer Limited by Transistors. It Is Becoming Limited by Package Area
DR. ROBERT CASTELLANO
JUN 16, 2026
∙ PAID
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What’s In This Article
The Next AI Bottleneck Has Arrived
Chart 1. CoWoS and CoPoS Cost Crossover
Why CoWoS Is Reaching Its Limits
Table 1. Evolution of TSMC Advanced Packaging Technologies
CoPoS Expands Package Area by More Than 5x
Table 2. CoWoS Versus CoPoS
Panel-Leve
2026-06-16
evertiq.com
2026-06-16
Evertiq
© Air Liquide
Electronics Production | June 16, 2026
Air Liquide invests €200M in Korea to back SK hynix’s AI chip project
Evertiq
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
France’s Air Liquide has signed a long-term contract with SK hynix.
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions
Simply Wall St
Mon, June 15, 2026 at 8:20 PM PDT 2 min read
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Qualcomm, ticker NasdaqGS:QCOM, is reportedly in talks to acquire AI chip startup Tenstorrent
2026-06-16
www.msn.com
2026-06-16
MSN
Elon Musk’s SpaceX went public on Friday, exploding onto the scene with a valuation that quickly eclipsed $2 trillion.
Things went swimmingly for a while, with shares steadily rising from a debut $150 — a premium of 11 percent over the original asking price — on Friday to well over $200 on Tuesday. But after peaking at $222 Tuesday morning, SpaceX started its first sustained decline of its nascen
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
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