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2026-06-12
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead
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digitimes.com 2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-08
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
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digitimes.com 2026-06-08
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
2026-05-11
Taiwan Semiconductor’s Dominance in Packaging Faces Subtle Shifts: SK Hynix Collaborates with Intel to Test EMIB Technology, Potentially Triggering Significant Changes in the AI Chip Supply Chain - Moomoo
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www.moomoo.com 2026-05-11 Moomoo
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