Semiconductor News & Analysis Feed

177 articles
2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
ASE Tech, TW0003711008 New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips 16.06.2026 - 03:43:12 | ad-hoc-news.de ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers. AS
2026-06-16
digitimes.com 2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com 2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
www.techtimes.com 2026-06-16 Tech Times
By Allen Lee Published: Jun 15 2026, 15:57 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-15
www.benzinga.com 2026-06-15 Benzinga
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2026-06-15
cryptobriefing.com 2026-06-15 Crypto Briefing
ByteDance in talks to acquire AI chips from Iluvatar CoreX in push away from Nvidia TikTok's parent company is negotiating to buy at least 50,000 AI inference GPUs from the Shanghai-based chipmaker as
2026-06-15
digitimes.com 2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-12
www.investopedia.com 2026-06-12 Investopedia
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2026-06-11
www.tradingview.com 2026-06-11 TradingView
News / TradingView / Key facts: TSMC May Revenue Up 30.1% YoY; AI Chips Boost Growth Key facts: TSMC May Revenue Up 30.1% YoY; AI Chips Boost Growth Less than 1 min read 2330 −0.22% TSMC (2330) May 2026 revenue NT$416.975B (~$13.17B), +30.1% YoY, +1.5% MoM; Jan–May revenue NT$1,961.804B (~$62B), +30.0% YoY, driven by AI infrastructure, smartphones, HPC demand 1 2 TSMC (2330) gains from rising A
2026-06-10
digitimes.com 2026-06-10
Taiwan is considering significantly tougher restrictions on exports of advanced AI chips to China, a move that would bring the island's regulations closer to those of the US and strengthen efforts to combat semiconductor smuggling, according to Bloomberg.
2026-06-10
digitimes.com 2026-06-10
As demand for AI chips continued to surge, utilization rates at advanced semiconductor process lines kept climbing, making the circular-economy treatment of waste hydrofluoric acid and calcium fluoride sludge an essential service. Liying said the company's core strength lay in using intelligent production parameters to improve waste purity and regenerate the materials into green synthetic fluorite
2026-06-09
the-decoder.com 2026-06-09 The Decoder
Short News Copy the url to clipboard Share this article Go to comment section Intel gets a second life as Google and Nvidia explore it as a TSMC backup for AI chips Matthias Bastian View the LinkedIn Profile of Matthias Bastian Jun 8, 2026 Google and Nvidia are looking at Intel as an alternative chipmaker as TSMC struggles to keep up with surging demand for AI chips. According to The Information,
2026-06-08
www.myeverydaytech.com 2026-06-08 My Everyday Tech
Consumer News & Events Cadence strikes new partnership with Samsung Foundry to deliver 2nm platform for AI chips 8 minutes ago Calvin Liew   Cadence and Samsung Foundry announced a multi-year expansion of their collaboration to develop a full portfolio of Memory and Interface IP certified for Samsung Foundry’s second-generation 2nm process technology.Mobile & Wireless The signoff-ready platfor
2026-06-08
seekingalpha.com 2026-06-08 Seeking Alpha
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2026-06-08
simplywall.st 2026-06-08 simplywall.st
United States/Semiconductors/NasdaqGS:NVDA AI Chips Today - NVIDIA and SK hynix: Advancing AI Infrastructure Together June 08, 2026 Simply Wall St NVIDIA and SK hynix have announced a multiyear technology partnership aimed at developing next-generation memory to support the global buildout of AI factories. This collaboration is set to enhance memory supply aligned with NVIDIA's AI infrastructure
2026-06-08
www.fool.com 2026-06-08 The Motley Fool
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2026-06-08
finance.yahoo.com 2026-06-08 Yahoo Finance
Amazon, Alphabet, and Microsoft Are All Racing to Design Their Own AI Chips. Here's What It Means for Nvidia. Daniel Sparks, The Motley Fool Sun, June 7, 2026 at 3:32 PM PDT 5 min read NVDA -6.20% AMZN -3.06% GOOG -0.95% MSFT -2.66% Explore stocks on Coinbase Trading disclosure Three of the largest buyers of Nvidia (NASDAQ: NVDA) chips are also three of the companies trying hardest to need fewer
2026-06-07
finance.yahoo.com 2026-06-07 Yahoo Finance
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2026-06-06
the-decoder.com 2026-06-06 the-decoder.com
Short News Copy the url to clipboard Share this article Go to comment section SpaceX signs $920 million per month deal with Google for 110,000 Nvidia AI chips ahead of IPO Matthias Bastian View the LinkedIn Profile of Matthias Bastian Jun 6, 2026 SpaceX signed a $920 million per month contract with Google, according to an SEC filing. The deal runs from October 2026 through June 2029, potentially
2026-06-06
www.rswebsols.com 2026-06-06 RS Web Solutions
Table of Contents US Commerce Department Closes AI Chip Loophole Amid Ongoing Tensions The U.S. Commerce Department discreetly updated its website on Sunday, marking a pivotal shift in policy that addresses a longstanding loophole that has, for the past year, permitted the potential influx of Nvidia’s advanced AI chips to Chinese enterprises via intermediaries in countries such as Malaysia. The