Semiconductor News & Analysis Feed
20 articles
2026-08-21
seekingalpha.com
2026-08-21
2026-08-21
beincrypto.com
2026-08-21
2026-08-21
finance.yahoo.com
2026-08-21
2026-08-21
2026-08-21
news.google.com
2026-08-21
2026-08-05
2026-08-04
seekingalpha.com
2026-08-04
2026-07-25
newsroom.intel.com
2026-07-25
Intel's collaboration with Lens Technology represents a significant advancement in semiconductor packaging for the AI era. This partnership combines Intel's chip design expertise with Lens Technology's advanced packaging capabilities to develop next-generation solutions for AI computing demands. The
2026-07-21
www.forbes.com
2026-07-21
2026-07-14
news.google.com
2026-07-14
2026-07-14
news.google.com
2026-07-14
2026-07-05
news.google.com
2026-07-05
2026-06-30
www.koreaherald.com
2026-06-30
Samsung Electronics and SK Hynix have announced plans to invest approximately 800 trillion won ($518 billion) in South Korea's southwest region to build new semiconductor manufacturing bases, responding to surging demand for memory chips driven by AI. Despite the existing Yongin semiconductor cluste
2026-06-27
pulse2.com
2026-06-27
Qualcomm Technologies unveiled a new data center roadmap and product portfolio tailored for the agentic AI era, addressing the rising demand for AI inference in data centers. Key offerings include the Dragonfly C1000 CPU, High Bandwidth Compute (HBC) technology, the Dragonfly AI300 inference acceler
2026-06-25
www.qualcomm.com
2026-06-25
At its Investor Day, Qualcomm unveiled a comprehensive roadmap for the data center era driven by agentic AI, introducing its new 'Dragonfly' portfolio including the C1000 CPU, High Bandwidth Compute (HBC), AI300 inference accelerator, and connectivity products. These solutions are engineered to maxi
2026-06-25
news.google.com
2026-06-25
2026-06-23
briefglance.com
2026-06-23
As Moore's Law reaches its physical limits, Qnity Electronics is betting on chip stacking technologies to meet the growing demands of AI, high-performance computing, and next-generation networks. Traditional approaches of shrinking transistors are facing cost and physical constraints, prompting a sh
2026-06-19
pandaily.com
2026-06-19
As AI and data center technologies advance rapidly, silicon carbide (SiC), as a next-generation wide-bandgap semiconductor material, is entering a pivotal application phase. Market forecasts indicate the global SiC device market will reach approximately $11 billion by 2031, growing at over 20% CAGR,
2026-06-17
www.qualcomm.com
2026-06-17
Qualcomm unveiled its Snapdragon Reality Elite platform at the Augmented World Expo, designed to power immersive spatial computing experiences with high visual fidelity and deeply integrated on-device AI. The platform supports a wide range of form factors, including all-in-one video-see-through (VST
2026-06-17
siliconangle.com
2026-06-17
Qualcomm has unveiled its new Snapdragon Reality Elite chip, marking a significant step toward integrating artificial intelligence into spatial computing. The chip, succeeding the XR2+ Gen 2, represents a generational leap in performance and repositions the silicon as an AI platform, enabling next-g