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Nvidia and SK Hynix sign multi-year pact to develop next-gen AI memory chips The partnership targets HBM4 memory for Nvidia's Vera Rubin platform, with initial deliveries planned for Q3 2026.

SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b

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