Semiconductor News & Analysis Feed
9 articles
2026-08-09
news.google.com
2026-08-09
2026-07-23
cryptobriefing.com
2026-07-23
As artificial intelligence continues to advance, high bandwidth memory (HBM) has become a critical component of AI infrastructure, and Samsung Electronics is quietly emerging as a key player in this space. While NVIDIA has been the default choice for investors seeking exposure to AI, Samsung has bee
2026-07-10
finance.yahoo.com
2026-07-10
Micron Technology announced on July 10, 2026, that it is raising its planned U.S. investment to over $250 billion through 2035, a $50 billion increase from its previous commitment, driven by rising demand for memory chips in the AI era. The company aims to produce 40% of its DRAM output in the U.S.,
2026-07-10
qz.com
2026-07-10
Micron Technology announced on Thursday that it is raising its planned U.S. investment to over $250 billion through 2035, a $50 billion increase from its previous commitment, driven by surging demand for memory chips in the AI era. The company aims to reach 40% of global DRAM output on U.S. soil, wi
2026-06-22
eciks.org
2026-06-22
Micron Technology's stock hit a record high of $1,133.99 on June 18, 2026, driven by surging demand for memory chips fueled by the artificial intelligence (AI) boom. The semiconductor manufacturer is experiencing unprecedented shortages in both DRAM and high-bandwidth memory (HBM), critical componen
2026-06-18
seekingalpha.com
2026-06-18
2026-06-09
cryptobriefing.com
2026-06-09
NVIDIA and SK Hynix have entered a multi-year collaboration to co-develop next-generation memory chips tailored for AI workloads, with a focus on HBM4 technology for NVIDIA's upcoming Vera Rubin platform, set for delivery in Q3 2026. This partnership goes beyond a typical supply agreement, encompass
2026-05-26
vir.com.vn
2026-05-26
SK hynix has launched its iHBM (integrated high-bandwidth memory) solution to address thermal challenges in next-generation AI memory chips. As demand for AI and high-performance computing grows, HBM technology advances toward higher stacking and faster speeds, intensifying heat dissipation issues.
2026-05-08
www.benzinga.com
2026-05-08