Semiconductor News & Analysis Feed
24 articles
2026-07-08
247wallst.com
2026-07-08
24/7 Wall St.
2026-07-08
finance.yahoo.com
2026-07-08
Yahoo Finance
2026-07-06
digitimes.com
2026-07-06
Anthropic's reported move into in-house chip development could matter well beyond Silicon Valley if it helps lower the cost of running AI services worldwide. By prioritizing cheaper inference rather than elite performance, the startup may be signaling a more pragmatic path that could influence how global AI systems are built and priced.
2026-07-03
digitimes.com
2026-07-03
Kioxia has begun sample shipments of 1Tb triple-level-cell memory devices built with its 10th-generation BiCS FLASH 3D flash memory technology. The move underscores the race to supply higher-capacity, lower-power storage for AI systems, data centers, and enterprise customers worldwide as demand for advanced memory continues to rise.
2026-06-30
eetimes.com
2026-06-30
MCP gives enterprise AI a common, open plumbing layer to connect models with tools, data, and agents.
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-25
digitimes.com
2026-06-25
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed, lower costs, and reduce operational complexity across inference, search, and training, which could influence how global enterprises deploy production AI.
2026-06-23
news.google.com
2026-06-23
Stock Titan
2026-06-09
www.designworldonline.com
2026-06-09
Design World
www.designworldonline.com
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2026-06-09
news.google.com
2026-06-09
Stock Titan
2026-06-08
news.google.com
2026-06-08
EE Times India
2026-06-05
tomshardware.com
2026-06-05
Luke James
Anthropic has published a report warning that the development path it’s on could eventually leave humans unable to control AI systems.
2026-06-04
news.google.com
2026-06-04
EE Times Asia
2026-06-01
www.barrons.com
2026-06-01
Barron's
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2026-06-01
www.investing.com
2026-06-01
Investing.com
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2026-06-01
www.investing.com
2026-06-01
Investing.com
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2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-27
au.finance.yahoo.com
2026-05-27
Yahoo Finance Australia
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2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.