Semiconductor News & Analysis Feed

Onsemi and Synaptics to merge in a bid to build comprehensive platforms for robotics, physical AI applications.

Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.

Amid growing localization efforts across China's supply chain, FineMat Applied Materials has seen its metal mask business continue to shrink and is accelerating its transition into AI cooling, semiconductors, and drones. The company's liquid-cooling cold plates for AI applications have already been sampled by end customers and are expected to begin shipping in the second half of 2026. Once volume

Taiwan's memory chip designers are heading into a sharply stronger 2026 as rising memory prices and a wave of AI-driven demand push the industry away from consumer electronics and toward higher-value data center and AI applications.

HEDGE FUND INVESTOR LETTERS - NEWS Increased Demand for AI Applications Boosted Texas Instruments (TXN) in Q1 Published on June 16, 2026 at 10:15 am by SOUMYA ESWARAN in Hedge Fund Investor Letters, News SHARE Madison Investments, an investment advisor, released its first-quarter 2026 investor letter for the “Madison Large Cap Fund”. A copy of the letter is available to download here. The Madison

Increased Demand for AI Applications Boosted Texas Instruments (TXN) in Q1 Soumya Eswaran Tue, June 16, 2026 at 7:15 AM PDT 3 min read TXN -2.44% ^GSPC -0.57% Trade TXN on Coinbase Trading disclosure Madison Investments, an investment advisor, released its first-quarter 2026 investor letter for the "Madison Large Cap Fund". A copy of the letter is available to download here. The Madison Large Cap

DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications, tightening supply of mainstream DDR5 and DDR4 products used in PCs, servers, and other electronics, according to Nikkei.

At Microsoft Build, the company debuted its Surface RTX Spark Dev Box, a system for developers to come up with new AI applications.

UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu

Hotai Motor Co. told shareholders on May 27 that Taiwan's auto market was expected to strengthen in 2026 as demand for semiconductors and AI applications supported exports and the broader economy. The company forecast the full-year vehicle market could reach 440,000 units, attributing the outlook to a stabilizing global economy, policy continuity and a pickup in replacement demand.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board