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Since the second half of 2025, the global semiconductor industry has been squeezed by a rare convergence of forces: surging artificial intelligence (AI) demand, escalating geopolitical fragmentation, and...The article requires paid subscription.Subscribe Now

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As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up

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The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.

TSMC slams the gas to expand chip production for AI giants, but shortages loom.