Semiconductor News & Analysis Feed
105 articles
2026-07-11
digitimes.com
2026-07-11
Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand are lifting overall earnings, while TVs, home appliances, and other end-device businesses remain under pressure.
2026-07-10
news.google.com
2026-07-10
Amazon Web Services (AWS)
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-09
2026-07-09
tomshardware.com
2026-07-09
Luke James
Global data center electricity consumption will grow 26% in 2026 to reach 565 TWh, up from 447 TWh in 2025.
2026-07-09
digitimes.com
2026-07-09
Edom Technology reported record first-half revenue for 2026, driven by rising demand for AI servers and networking equipment. The IC distributor said June consolidated revenue reached NT$12.573 billion, down 9.23% from May but up 60.10% from a year earlier, marking its third-highest monthly result on record.
2026-07-09
digitimes.com
2026-07-09
CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade 17nm production, expand DDR5, and develop HBM for AI servers and high-performance computing.
2026-07-09
www.gurufocus.com
2026-07-09
GuruFocus
2026-07-08
www.openpr.com
2026-07-08
openPR.com
2026-07-08
digitimes.com
2026-07-08
AI servers are tightening Taiwan's power component supply chain, lifting demand for MOSFETs, PMICs, cooling motors and power management products even as weak PC demand limits suppliers' ability to pass on higher costs.
2026-07-07
www.benzinga.com
2026-07-07
Benzinga
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2026-07-07
digitimes.com
2026-07-07
AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.
2026-07-07
news.google.com
2026-07-07
Yahoo Finance
2026-07-06
news.google.com
2026-07-06
Bloomberg.com
2026-07-06
digitimes.com
2026-07-06
Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
2026-07-06
digitimes.com
2026-07-06
Hon Hai Precision Industry (Foxconn) reported consolidated revenue for June 2026 on July 5, with continued demand for AI servers and cloud networking products driving record performance. Revenue for June, the second quarter, and the first half of 2026 all reached record highs for the corresponding periods.
2026-07-05
news.google.com
2026-07-05
Benzinga
2026-07-05
digitimes.com
2026-07-05
Surging demand for high-bandwidth memory (HBM) used in AI servers has driven shortages and sharp price increases for conventional memory, while microcontroller (MCU) suppliers have also begun passing higher costs on to customers. Apple raised prices for certain Mac and iPad models in late June, and market rumors suggest the upcoming iPhone 18 could see price increases of as much as 30%.
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-03
digitimes.com
2026-07-03
Renesas Electronics has completed the sale of its timing device business to US fabless semiconductor specialist SiTime, tightening its portfolio around AI servers, electric vehicles, embedded computing and software-led chip design.