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2026-06-18
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2026-06-18
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.
2026-06-18
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2026-06-18
Taiwan's electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas in
2026-06-18
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2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.
2026-06-18
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2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
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2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.
2026-06-18
digitimes.com
2026-06-18
Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com
2026-06-18
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
digitimes.com
2026-06-18
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's existing production capacity. The announcement comes amid another round of price increases in the passive components industry.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
digitimes.com
2026-06-18
Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.
2026-06-18
stocksdownunder.com
2026-06-18
Stocks Down Under
Tape-out clears the path to validation data, with compute-in-memory and TSMC-sourced wafers framing the commercial pitch
dorsaVi (ASX:DVL) has reached the moment its RRAM equity story has been pointing toward for the better part of two years. The company has finalised the full design package for its first integrated RRAM-CMOS validation chip, developed alongside NTU Singapore and ITRI Taiwan, and
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
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SK hynix Ships 12-Layer HBM4E Samples to Customers
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June 17, 2026
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SK hynix announced it has shipped samples of its 12-layer HBM4E high-bandwidth memory to major customers, according to a PR Newswire release carried by Manila Times, Morningstar and ot
2026-06-18
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2026-06-18
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2026-06-18
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Nvidia supplier SK Hynix ships samples of next-generation chips to major customers
Nvidia supplier SK Hynix ships samples of next-generation chips to major customers
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2026-06-18
PR Newswire
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
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SK hynix Inc.
Jun 17, 2026, 19:35 ET
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- Delivers 12-high HBM4E samples to major customers
- Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency
- Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability
- SK hynix st