Semiconductor News & Analysis Feed
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2026-06-16
tomshardware.com
2026-06-16
Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
2026-06-16
ca.investing.com
2026-06-16
Investing.com Canada
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2026-06-16
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2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
FUNDING & BUSINESS
micron
hbm
market analysis
semiconductors
Micron's Sold-Out HBM Capacity Creates June 24 Catalyst
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June 15, 2026
5.5
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Photo: i-invdn-com.investing.com · rights & takedowns
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A Market Analysis highlights that Micron Technology Inc has sold out its HBM capacity and identifies June 24 as a make-or-break catalyst. The analysis also covers
2026-06-16
www.tradingview.com
2026-06-16
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Google's Samsung Talks Highlight TSMC Capacity Crunch
Google's Samsung Talks Highlight TSMC Capacity Crunch
Less than 1 min read
GOOG
+2.61%
Alphabet (GOOG, Financials) may be looking beyond Taiwan Semiconductor Manufacturing for part of its future AI chip production, and that says a lot about how tight the market has become.
Google is reportedly in talks with Samsung to make
2026-06-16
www.gurufocus.com
2026-06-16
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2026-06-15
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2026-06-15
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2026-06-15
www.engineering.com
2026-06-15
Engineering.com
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2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
datacentremagazine.com
2026-06-15
Data Centre Magazine
NVIDIA is strengthening its position in the AI infrastructure market through a series of agreements in South Korea that span memory supply, data centre development and AI-powered industrial systems.
During a four-day visit to Seoul, NVIDIA's CEO, Jensen Huang, secured agreements with SK hynix, SK Telecom, Naver, Doosan Group, LG Group and Hyundai Motor Group.
The financial terms to the partnersh
2026-06-15
evertiq.com
2026-06-15
Evertiq
© Liviorki for Evertiq
Business | June 15, 2026
CADFEM APAC, SilTerra partner to advance semiconductor innovation
Evertiq
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.
CADFEM APAC, a Hyderabad-ba
2026-06-15
www.indexbox.io
2026-06-15
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2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
Microns, HBM
Micron's HBM Capacity Is Sold Out Through 2026 — Now the Stock Faces a Fed-Week Gauntlet
14.06.2026 - 18:32:07 | boerse-global.de
Micron sold all 2026 HBM chips, but stock with 745% gain faces Fed rate decision on June 17 and fiscal Q3 earnings on June 24. Key support at 800 euros.
Microns - Micron's HBM Capacity Is Sold Out Through 2026 — Now the Stock Faces a Fed-Week Gauntlet 14.
2026-06-14
digitimes.com
2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a