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Trending Companies
NVIDIA229 Micron Technology108 TSMC85 SK Hynix77 Samsung57 Micron53 Infineon48 Microsoft43 Apple39 Intel30 AMD27 Meta26 Applied Materials23 Samsung Electronics23 Google22
Trending Technologies
EUV193 3nm167 AI87 AI chips82 DRAM74 HBM71 GPU67 memory chips49 semiconductor22 AI infrastructure22 NAND flash21 2nm18 NAND17 data center16 AI data centers15
2026-07-07
An Impulse for Germany, Europe and the World: Infineon Opens the World's Largest Fab for Power Semiconductors and Analog/Mixed-Signal Technologies in Dresden - AZoM
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www.azom.com 2026-07-07 AZoM
2026-07-07
Buy SK Hynix’s New ADRs and Sell Seoul-Listed Shares, UBS Says - Bloomberg.com
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www.bloomberg.com 2026-07-07 Bloomberg.com
2026-07-07
Samsung’s record profit fails to calm AI chip market - MSN
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www.msn.com 2026-07-07 MSN
2026-07-07
World Advanced Semiconductor Cooling Systems - Market Analysis, Forecast, Size, Trends and Insights - IndexBox
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www.indexbox.io 2026-07-07 IndexBox
2026-07-07
Reflective Film for Semiconductor Lighting Market Forecast Points Higher Toward 2035 on LED Efficiency Gains - IndexBox
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www.indexbox.io 2026-07-07 IndexBox
2026-07-07
Micron partners with Ford to strengthen long-term memory supply - Evertiq
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evertiq.com 2026-07-07 Evertiq
2026-07-07
Onsemi acquires Synaptics for 7 billion dollars: When the sensor specialist becomes an acquisition target - igor´sLAB
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www.igorslab.de 2026-07-07 igor´sLAB
2026-07-07
SK Hynix IPO Could Lift 3 Capital Markets Stocks - simplywall.st
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simplywall.st 2026-07-07 simplywall.st
2026-07-07
RF Power Controller ICs Market Forecast Points Higher Toward 2035 on 5G and Gan Adoption - IndexBox
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www.indexbox.io 2026-07-07 IndexBox
2026-07-07
World Metal Semiconductor Metal Photodetector - Market Analysis, Forecast, Size, Trends and Insights - IndexBox
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www.indexbox.io 2026-07-07 IndexBox
2026-07-07
MU, SNDK, DRAM Dip Overnight As Memory Stocks Feel Weight Of Samsung’s Post-Earnings Selloff - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
SK Hynix Launches $28 Billion Nasdaq IPO - marketscreener.com
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www.marketscreener.com 2026-07-07 marketscreener.com
2026-07-07
Samsung's push in high bandwidth memory chips makes sense despite its lower margins: Futurum - CNBC
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www.cnbc.com 2026-07-07 CNBC
2026-07-07
From Spuddy Buddy to a Micron chip: Here's what Idaho placed in America's 250-year time capsule - BoiseDev
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boisedev.com 2026-07-07 BoiseDev
2026-07-07
Navitas Semiconductor will report Q2 results July 27 after market close - Stock Titan
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news.google.com 2026-07-07 Stock Titan
2026-07-07
Samsung's profit soars 19 times as memory chip shortage continues - Nikkei Asia
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asia.nikkei.com 2026-07-07 Nikkei Asia
2026-07-07
Micron Stock Is Down 22% From Its High. Is the Trillion-Dollar Chipmaker's Dip a Buy? - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
Can Agentic AI Solve the Embedded Software Problem?
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eetimes.com 2026-07-07 Sally Ward-Foxton
Agents will also need CPU plus acceleration to run on edge devices, said Ambarella’s Muneyb Minhazuddin.
Embedded SoftwareAgentic AIChip CompanySoftware DevelopmentISVEdge ComputingSmart HardwareAutomated Development
2026-07-07
Memory prices defy cooling hopes as AI demand drives fresh 3Q26 hikes
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digitimes.com 2026-07-07
Memory contract prices are poised for another sharp rise in the third quarter of 2026, even after several quarters of hikes have already begun to weaken consumer demand. Industry sources said hopes for a clear slowdown have faded, as upstream suppliers have signalled increases of around 30%, with enterprise SSD and server RDIMM prices likely to rise by more than 30%.
2026-07-07
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
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digitimes.com 2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip