Semiconductor News & Analysis Feed
1016 articles
2026-06-25
digitimes.com
2026-06-25
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly infrastructure demand can affect component costs worldwide. The rally underscores a structural mismatch that could keep pressure on buyers across technology supply chains for years, according to industry sources.
2026-06-25
digitimes.com
2026-06-25
ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet for China's domestic AI chip industry.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
LIVE
Stock market today: Dow, S&P 500, Nasdaq futures rise as Micron, Qualcomm ease AI jitters
Amalya Dubrovsky
Wed, June 24, 2026 at 4:26 PM PDT 1 min read
MU
-0.31%
QCOM
-3.29%
^IXIC
-0.43%
^DJI
+0.35%
Explore stocks on Coinbase
Trading disclosure
US stock futures rose as Micron and Qualcomm helped boost confidence in the AI trade following several tough days for tech stocks.
Futures attached
2026-06-24
solarbytes.info
2026-06-24
Solarbytes
AMERICA BYTES
Enphase unveils GaN-based IQ9N microinverters for US residential lineup
For US homeowners, Enphase has introduced IQ9N microinverters with 97.8% peak efficiency, all-AC rooftop architecture and panel-level system monitoring.
by
Karthik Srivasthav G
24 Jun 2026 19:04 IST
The product is backward compatible with IQ7, IQ8 and IQ Batteries for existing Enphase systems. Image Source: Enph
2026-06-24
electronics360.globalspec.com
2026-06-24
Electronics360
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2026-06-24
tomshardware.com
2026-06-24
Jowi Morales
Valve engineers hinted that the nearly 45% price increase on the Steam Deck applied to the Steam Machine as well. This brings the estimated original price to under $750 for the base console.
2026-06-24
www.phoronix.com
2026-06-24
Phoronix
QSOE v0.1 Released As A QNX-Inspired RISC-V OS
Written by Michael Larabel in Operating Systems on 24 June 2026 at 06:05 AM EDT. 3 Comments
QSOE 0.1 has made its debut as a QNX-inspired, dual kernel architecture open-source operating system just targeting RISC-V.
QSOE ships with the same user-space and two kernel opttions: QSOE/N that is using the Skimmer micro-kernel that was written from scratch
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
Does Synopsys’ AI-Driven Multiphysics Fusion Platform Redefine the Bull Case for Synopsys (SNPS)?
Sasha Jovanovic
Wed, June 24, 2026 at 2:15 AM PDT 3 min read
SNPS
+2.11%
Trade SNPS on Coinbase
Trading disclosure
In June 2026, Synopsys launched its AI-driven Multiphysics Fusion platform, combining its electronic design automation tools with Ansys analysis to accelerate chip timing signoff and des
2026-06-24
www.sony-semicon.com
2026-06-24
sony-semicon.com
Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the LYTIA 610, a 1/2-type approximately 64-effective megapixel CMOS image sensor with the RB2×2 On Chip Lens (OCL) pixel structure. This is the industry’s first*1 product with this pixel structure to be mass produced.
By combining the RB2×2 OCL pixel structure with dedicated array conversion processing (remosa
2026-06-24
www.prnewswire.com
2026-06-24
PR Newswire
Sony Semiconductor Solutions to Release Advanced 1/2-type CMOS Sensor for Mobile Applications Featuring Industry's First*1 RB2×2 OCL Pixel Structure for Both High Resolution and AF Performance
NEWS PROVIDED BY
Sony Semiconductor Solutions Corporation
Jun 23, 2026, 22:00 ET
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New pixel design and algorithm deliver more than 20% higher definition compared to Sony's convent
2026-06-24
digitimes.com
2026-06-24
South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments, as the two chipmakers review plans that could include front-end fabrication plants and packaging facilities across the country's Honam and Chungcheong regions. Both companies say no final decisions have been made.
2026-06-24
digitimes.com
2026-06-24
China's LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming the first system to sustain more than two exaflops on the standard HPL benchmark using CPUs only. The result marks the first time since 2017 that a China-based system has led the TOP500 ranking, and reflects Beijing's effort to present a frontier computing system
2026-06-24
digitimes.com
2026-06-24
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
2026-06-24
digitimes.com
2026-06-24
The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads pushing the industry from doubler-based designs to direct native multi-phase control. Industry insiders say the growing shortage of power components has three main causes: inventory corrections over the past three yea
2026-06-24
digitimes.com
2026-06-24
SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a sharp profitability reversal makes the broader memory market too profitable to ignore.
2026-06-24
digitimes.com
2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.
2026-06-24
digitimes.com
2026-06-24
Reports of MediaTek price adjustments appear to confirm a broader pricing trend across Taiwan's IC design sector. Industry sources said many small and mid-sized chip suppliers have spent the past three months discussing potential price increases with customers, but MediaTek's move carries particular significance given its scale and market position.