Semiconductor News & Analysis Feed
1026 articles
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Increased Demand for AI Applications Boosted Texas Instruments (TXN) in Q1
Soumya Eswaran
Tue, June 16, 2026 at 7:15 AM PDT 3 min read
TXN
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Madison Investments, an investment advisor, released its first-quarter 2026 investor letter for the "Madison Large Cap Fund". A copy of the letter is available to download here. The Madison Large Cap
2026-06-16
news.google.com
2026-06-16
TechPowerUp
2026-06-16
tomshardware.com
2026-06-16
Jowi Morales
The legendary air cooling company is diving into water (cooling).
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Vadzo Imaging Introduces Falcon-544MRS: 5MP Monochrome USB Camera Based on Onsemi Hyperlux LP AR0544
Vadzo Imaging
Tue, June 16, 2026 at 7:00 AM PDT 15 min read
The Falcon-544MRS is a 5MP Monochrome Rolling Shutter USB 3.2 Gen1 Camera built on the Onsemi AR0544 Hyperlux LP sensor. It is designed for i
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
Is It Worth Investing in TSMC (TSM) Based on Wall Street's Bullish Views?
Zacks Equity Research
Tue, June 16, 2026 at 6:30 AM PDT 4 min read
2330.TW
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TSM
-3.53%
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Investors often turn to recommendations made by Wall Street analysts before making a Buy, Sell, or Hold decision about a stock. While media reports about rating changes by these brokerage-fir
2026-06-16
www.nvidia.com
2026-06-16
NVIDIA
Visit your regional NVIDIA website for local content, pricing, and where to buy partners specific to your country.
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Leading plat
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Qualcomm is in talks to buy RISC-V-based AI accelerator and CPU developer Tenstorrent for $8 billion - $10 billion.
2026-06-16
www.thefpsreview.com
2026-06-16
The FPS Review
NVIDIA/Intel Partnership Could See an x86 Processor Paired with RTX Graphics Released by 2028
NEWS
TECH
By
Peter Brosdahl
June 16, 2026
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Image: NVIDIA
A new rumor states that NVIDIA and Intel could be working together to develop a new type of x86 CPU with integrated RTX graphics. At on
2026-06-16
tomshardware.com
2026-06-16
Mark Tyson
After some teasing and a couple of red herrings Commodore today unveiled a retro-styled flip phone dubbed the Callback 8020.
2026-06-16
www.morningstar.com
2026-06-16
Morningstar
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PR Newswire
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
Provided by PR Newswire Jun 16, 2026, 6:30:00 PM
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
Valens Semiconductor's HDBaseT Chipsets Power
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
NEWS PROVIDED BY
Valens Semiconductor
Jun 16, 2026, 06:30 ET
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HOD HASHARON, Israel, June 16, 2026 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) today announced that its HDBaseT chipsets will form the connectivity infrastructure inside of Barco's ClickShare USB-C Extension ov
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
NEWS PROVIDED BY
Valens Semiconductor
16 Jun, 2026, 13:30 IDT
SHARE THIS ARTICLE
HOD HASHARON, Israel, June 16, 2026 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) today announced that its HDBaseT chipsets will form the connectivity infrastructure inside of Barco's ClickShare USB-C Extension ov
2026-06-16
tomshardware.com
2026-06-16
Hassam Nasir
Intel's cancelled "Arctic Sound" AI GPU based on the original Xe-HP architecture has been pictured sporting two tiles and 32GB of HBM2E.
2026-06-16
news.google.com
2026-06-16
TradingView
2026-06-16
www.boerse.de
2026-06-16
boerse.de
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2026-06-16
news.google.com
2026-06-16
TradingView
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Infineon, DE0006231004
New AI power push: Infineon’s XDP700 digital multiphase controllers target Nvidia MGX servers
16.06.2026 - 03:15:46 | ad-hoc-news.de
Infineon is sharpening its AI hardware focus with the XDP700 family of digital multiphase controllers, designed to deliver efficient, tightly regulated power to GPUs and accelerators in next-generation Nvidia MGX AI server platforms.
Infineon
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.