Semiconductor News & Analysis Feed
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2026-05-27
www.morningstar.com
2026-05-27
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LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
Provided by PR Newswire May 27, 2026, 8:00:00 PM
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at
2026-05-27
tomshardware.com
2026-05-27
Zhiye Liu
Lenovo has announced it is conducting an in-depth investigation of its Chinese retail supply chains following allegations that its recently released G02 retro-gaming handheld is enabling piracy.
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
tomshardware.com
2026-05-27
Luke James
The agreement allocates 10.5% of Samsung's semiconductor division operating profit as stock-based bonuses.
2026-05-27
www.ad-hoc-news.de
2026-05-27
AD HOC NEWS
Infineon Technologies AG, DE0006231004
Infineon Technologies AG: Release according to Article 40, Section 1 of the WpHG [the German Securities Trading Act] with the objective of Europe-wide distribution
27.05.2026 - 12:41:13 | dgap.de
Infineon Technologies AG / DE0006231004
EQS Voting Rights Announcement: Infineon Technologies AG
27.05.2026 / 12:41 CET/CEST
Dissemination of a Voting Rights Ann
2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.eqs-news.com
2026-05-27
EQS News
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2026-05-27
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2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
ARTIKEL TEILEN
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
news.google.com
2026-05-27
EE Times Asia
2026-05-27
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2026-05-27
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2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
digitimes.com
2026-05-27
WinWay Technology's orders are already booked out five to six months in advance, says company Chairman Mark Wang. He expects new production capacity coming online at the company's Kaohsiung facilities to gradually ease supply shortages and help drive record monthly and quarterly revenue growth throughout the second half of 2026.
2026-05-27
digitimes.com
2026-05-27
Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.
2026-05-27
semiengineering.com
2026-05-27
Gregory Haley
As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvil...
2026-05-27
digitimes.com
2026-05-27
Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.