18 articles
2026-05-21
www.thestandard.com.hk
2026-05-21
The Standard (HK)
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2026-05-21
basic-tutorials.com
2026-05-21
Basic Tutorials
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2026-05-21
digitimes.com
2026-05-21
During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology transformations, concerns over capital expenditure bubbles among global cloud giants, changes in application-specific integrated circuits (ASICs) and chip architectures, and TSMC's global expansion strategy.
2026-05-21
digitimes.com
2026-05-21
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used in high-end CPUs, GPUs, ASICs, and networking chips.
2026-05-20
www.bitget.com
2026-05-20
bitget.com
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2026-05-20
digitimes.com
2026-05-20
Recent media reports say Google is set to team up with Blackstone to form a new cloud computing leasing company, with Blackstone as the main shareholder. The new venture aims to build about 500 MW of computing capacity by 2027, most of it using Google's Tensor Processing Units (TPUs), a move industry watchers say supports Google ASIC partners such as MediaTek, Broadcom, and TSMC.
2026-05-14
digitimes.com
2026-05-14
Tencent Holdings Limited reported a 9% year-over-year increase in total revenue to CNY196 billion (approx. US$28.86 billion) for the first quarter of 2026, driven by a strategic pivot toward artificial intelligence (AI) and stabilized growth in its core gaming and advertising segments. Company executives highlighted the quarter as a turning point, noting "significant initial progress on our new AI
2026-05-13
digitimes.com
2026-05-13
Taiwan's ASIC and design services sector is showing sharply diverging fortunes in 2026, with new monthly revenue data highlighting strong momentum for GUC while rivals Faraday and Alchip face a slower start to the year.
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-12
www.trendforce.com
2026-05-12
TrendForce
HomeNews
2026-05-12
digitimes.com
2026-05-12
As the semiconductor industry grapples with the growing energy demands of artificial intelligence, Cyient Semiconductors is repositioning itself away from being a primarily semiconductor engineering and ASIC services provider and toward a more product-oriented hybrid model centered on intelligent power and proprietary semiconductor products.
2026-05-11
www.openpr.com
2026-05-11
openPR.com
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2026-05-07
sg.finance.yahoo.com
2026-05-07
Yahoo Finance Singapore
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2026-05-07
finance.yahoo.com
2026-05-07
Yahoo Finance
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2026-05-07
uk.finance.yahoo.com
2026-05-07
Yahoo Finance UK
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2026-05-07
www.openpr.com
2026-05-07
openPR.com
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2026-05-05
digitimes.com
2026-05-05
Ardentec's Longtan plant is set to begin taking AI ASIC wafer-probing orders in the third quarter of 2026, as the semiconductor testing provider moves to capture spillover demand from foundry strategic partners.
2026-04-21
eetimes.com
2026-04-21
Padma Nagaraja
ASIC design shifts to modular, multi-die systems to beat AI-driven complexity.