SemiPulse — Semiconductor Intelligence

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng

Tech Forum 2026: AI agents drive Arm CPU demand surge; 2026 shipments expected to exceed 6 million units

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digitimes.com 2026-05-22

On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, "AI server market outlook and trends amid the explosion of agent applications." In it, Hsiao explained that demand is rising sharply not only for x86 server CPUs from Intel and AMD, but also for Arm-based CPUs, which are expected to see explosive growth in 2026.

Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026

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digitimes.com 2026-05-22

At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for AI, and AI-driven quality engineering. Startups, including Enclave Semiconductor, Bedrock Semiconductor, and Lattice, presented solutions aimed at securing and optimizing the global electronics ecosystem.

AMD deepens China packaging alliance with TF-AMD expansion in Suzhou

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digitimes.com 2026-05-22

AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.

AIC expands analog ICs into fiber optics; orders reach 1Q27

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digitimes.com 2026-05-22

AIC's expansion from analog ICs into fiber-optic components and other products, and its inclusion in a major US cloud service provider's supply chain, extend order visibility to the first quarter of 2027, signaling global demand pressures and supply-chain implications for cloud infrastructure suppliers and telecom equipment markets worldwide.

Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens

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digitimes.com 2026-05-22

Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market

Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub

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digitimes.com 2026-05-22

Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall

Amkor expands Arizona semiconductor packaging campus with additional 67 acres

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digitimes.com 2026-05-22

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.

EverDisplay appoints former Hua Hong executive as chairman in board overhaul

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digitimes.com 2026-05-22

China AMOLED panel maker EverDisplay Optronics completed a board reshuffle and senior management overhaul after a board meeting on May 20, appointing a former Hua Hong Semiconductor executive as chairman and naming a new general manager as it builds a new leadership team. The changes included a slate of shareholder-representative directors and retained an existing director, the firm announced.

AMD deepens Taiwan supply chain ties with US$10B-plus push

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digitimes.com 2026-05-22

AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan's industrial ecosystem to accelera

WPG Holdings flags server supply gaps amid memory price hikes, 800V shift

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digitimes.com 2026-05-22

Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.