2883 articles
2026-05-22
digitimes.com
2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan's industrial ecosystem to accelera
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains in an early phase of growth.
2026-05-22
digitimes.com
2026-05-22
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on next-generation 10A and 7A nodes.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.
2026-05-22
digitimes.com
2026-05-22
South Korea announced a national plan to raise domestic production of defense semiconductors to 50% by 2029, targeting heavy reliance on US and Taiwan supply chains to bolster national security. The initiative, unveiled at the 2026 Advanced Strategic Semiconductor Innovation Conference, covers research and development, manufacturing, ecosystem building and workforce training and follows the recent
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics is reportedly preparing to shift more of its gallium nitride (GaN) power semiconductor strategy toward foundry services after struggling to secure customers for its own GaN devices and modules, according to The Elec.
2026-05-22
digitimes.com
2026-05-22
Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.
2026-05-22
digitimes.com
2026-05-22
On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, "AI server market outlook and trends amid the explosion of agent applications." In it, Hsiao explained that demand is rising sharply not only for x86 server CPUs from Intel and AMD, but also for Arm-based CPUs, which are expected to see explosive growth in 2026.
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
AIC's expansion from analog ICs into fiber-optic components and other products, and its inclusion in a major US cloud service provider's supply chain, extend order visibility to the first quarter of 2027, signaling global demand pressures and supply-chain implications for cloud infrastructure suppliers and telecom equipment markets worldwide.
2026-05-22
digitimes.com
2026-05-22
At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for AI, and AI-driven quality engineering. Startups, including Enclave Semiconductor, Bedrock Semiconductor, and Lattice, presented solutions aimed at securing and optimizing the global electronics ecosystem.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.
2026-05-22
digitimes.com
2026-05-22
Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.
2026-05-22
digitimes.com
2026-05-22
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall
2026-05-22
digitimes.com
2026-05-22
China AMOLED panel maker EverDisplay Optronics completed a board reshuffle and senior management overhaul after a board meeting on May 20, appointing a former Hua Hong Semiconductor executive as chairman and naming a new general manager as it builds a new leadership team. The changes included a slate of shareholder-representative directors and retained an existing director, the firm announced.
2026-05-22
digitimes.com
2026-05-22
Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.
2026-05-22
digitimes.com
2026-05-22
Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.
2026-05-22
simplywall.st
2026-05-22
simplywall.st
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