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2026-07-06
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2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
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2026-07-06
Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
2026-07-06
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2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
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2026-07-06
United Microelectronics Corp. (UMC) reported its strongest quarterly run in years as mature-process demand and factory utilization improved. June consolidated revenue reached NT$23.12 billion, up 0.8% from May and 22.85% year-on-year — a 44-month high. Second-quarter revenue climbed to NT$68.73 billion, up 12.61% sequentially and 16.98% year-on-year, the highest level in 15 quarters.
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SK Hynix Seeks Nasdaq Listing For AI Memory
7 sources
|
July 5, 2026
|
By LDS Team
7.8
Relevance Score
QUICK SUMMARY
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SK Hynix is pursuing a Nasdaq ADS/ADR listing expected on July 10, 2026, with filings and reports pointing to up to 17.79 million new shares and about 45.45 trillion won in potential proceeds for AI-memory cap
2026-07-06
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