Semiconductor News & Analysis Feed
9473 articles
2026-07-02
blogs.nvidia.com
2026-07-02
NVIDIA Blog
NVIDIA Unlocks AI Compute at Scale, Inviting Partners to Power the AI Infrastructure Buildout
NVIDIA is partnering with AI clouds to deploy large‑scale, multi‑tenant AI factories, aligning economics through a revenue-sharing and credit-support model.
July 1, 2026 by Colette Kress and Raj Mirpuri
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As AI moves from model development to production inference, compute demand is accelerating a
2026-07-02
www.theinformation.com
2026-07-02
The Information
How Small Firms Use Claude to Quit Salesforce
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2026-07-02
www.digitimes.com
2026-07-02
digitimes
Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project as a platform for next-generation custom silicon aimed at AI data center infrastructure.
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2026-07-02
biz.chosun.com
2026-07-02
Chosunbiz
By
Hwang Min-gyu
Published 2026.07.02. 11:12
Lee Jae-yong, chair of Samsung Electronics, delivers a welcome address at the national briefing on the Chungcheong advanced industry development vision presided over by President Lee Jae-myung in Asan, South Chungcheong, on the 2nd. /Courtesy of Yonhap News
Samsung said on the 2nd at the Chungcheong Advanced Industry Development Vision national briefi
2026-07-02
simplywall.st
2026-07-02
simplywall.st
United States/Semiconductors/NasdaqGS:TSEM
Tower Semiconductor (TSEM) Pullback Puts Its Undervalued Narrative To The Test
July 02, 2026
Simply Wall St
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Tradr ETFs has launched a new Cboe-listed leveraged ETF that seeks to deliver two times the daily performance of Tower Semiconductor (NasdaqGS:TSEM), putting fresh attention on how the stock trades around short term moves.
See our
2026-07-02
letsdatascience.com
2026-07-02
Let's Data Science
INFRASTRUCTURE
hbm packaging
semiconductor investment
south korea
semiconductors
Samsung and SK hynix Build HBM Packaging Fabs
15 sources
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July 2, 2026
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By LDS Team
7.4
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Photo: newsimg.koreatimes.co.kr · rights & takedowns
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Samsung Electronics and SK hynix will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a
2026-07-02
www.12news.com
2026-07-02
12News
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You don't have permission to access "http://www.12news.com/article/news/local/valley/tsmc-interns-trade-badges-for-mentor-hats-to-inspire-future-engineers-phoenix-arizona/75-b7dc14c1-1e6f-4eaa-91ab-429f771d6b78" on this server.
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2026-07-02
www.digitaltoday.co.kr
2026-07-02
디지털투데이
AI & Enterprise
Qualcomm unveils 'High Bandwidth Compute' as HBM alternative, enters AI chip race
AI Summary
Qualcomm is stepping up its return to the data centre AI chip market with a new memory architecture using LPDDR instead of high-bandwidth memory (HBM). It unveiled High Bandwidth Compute and plans to launch its AI250 inference accelerator in mid-2027. Qualcomm says the near-memory design c
2026-07-02
www.yahoo.com
2026-07-02
Yahoo
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TSMC interns trade badges for mentor hats to inspire future engineers
Trisha Hendricks
Updated Thu, July 2, 2026 at 9:15 AM GMT+8
4 min read
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2026-07-02
www.deseret.com
2026-07-02
Deseret News
SCIENCE
UTAH
New partnership touts nuclear-powered AI with minimal water use
Valar Atomics and Nvidia made an announcement in Orangeville, Utah, on Wednesday
Published: July 1, 2026, 7:00 p.m. MDT
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Valar Atomics and Nvidia celebrate a milestone in atomic energy and artificial intelligence at a large party gathering at the Orangeville si
2026-07-02
simplywall.st
2026-07-02
simplywall.st
United States/Semiconductors/NasdaqGS:AMAT
Why Applied Materials (AMAT) Is Up 10.5% After New AI Chip Tools And Index Reclassification
July 02, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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In late June 2026, Applied Materials introduced a suite of new epitaxy, CMP, deposition and eBeam systems aimed at enabling advanced 3D chip architectures, DRAM performance gains and high-yiel
2026-07-02
seekingalpha.com
2026-07-02
Seeking Alpha
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2026-07-02
seekingalpha.com
2026-07-02
Seeking Alpha
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2026-07-02
www.foreignpolicyjournal.com
2026-07-02
foreignpolicyjournal.com
Meta Platforms (NASDAQ: META) shares jumped sharply, delivering one of the session’s standout performances even as broader market sentiment remained cautious heading into a pivotal week.
The Dow Jones Industrial Average slipped modestly, declining 0.03% as investors weighed competing signals across the technology and artificial intelligence sectors.
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Meta’s str
2026-07-02
digitimes.com
2026-07-02
Singapore authorities have filed additional fraud and money laundering charges against four individuals and brought fresh charges against four companies, as part of an investigation linked to the movement of servers that may have contained Nvidia artificial intelligence chips subject to US export controls. The case has been reported by multiple outlets, including CNA, The Straits Times, and Reuter
2026-07-02
semiengineering.com
2026-07-02
Liz Allan
The EV revolution relies on battery innovation, while AI data centers need a range of n...
2026-07-02
digitimes.com
2026-07-02
Qualcomm recently launched its Dragonfly platform, signaling a deeper push into cloud artificial intelligence and intensifying competition with MediaTek. For global readers, the move highlights how chip suppliers are jockeying to win long-term contracts from major cloud providers, where design wins can shape revenue, supply chains, and future AI infrastructure.
2026-07-02
digitimes.com
2026-07-02
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies, drawing on system-on-chip (SoC) development work the company has done for its own products since the early 2000s, according to industry sources cited by ZDNet Korea. LG declined to confirm the report when contacted.
2026-07-02
digitimes.com
2026-07-02
Samsung Electronics used its annual foundry ecosystem event on July 1 to signal that its contract chipmaking business is regaining momentum, laying out a longer-term manufacturing roadmap alongside signs of firmer near-term demand.
2026-07-02
digitimes.com
2026-07-02
China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and a 12-inch wafer fab reportedly slated to begin mass production in the second half of 2026. Industry analysts say China is extending display technologies built up with strong government backing into semiconductors as the US tightens restrictions, adding pressure on S