Semiconductor News & Analysis Feed
243 articles
2026-06-16
wccftech.com
2026-06-16
Wccftech
The U.S. trade sanctions on Huawei pretty much mean the latter is fighting an uphill battle with other chipmakers, as it lacks access to the latest and greatest in EUV equipment. Fortunately, a new report states that later this year, when the Mate 90 series materializes, the former Chinese giant will finally show to the world that its use of DUV machinery is sufficient to mass produce competitive
2026-06-16
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2026-06-16
MarketWatch
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-15
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2026-06-15
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2026-06-15
www.bloomberg.com
2026-06-15
Bloomberg.com
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2026-06-15
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2026-06-15
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2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-13
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2026-06-13
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2026-06-12
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2026-06-12
South China Morning Post
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China’s chip design software firms back Huawei’s new scaling law. But can they catch US rivals?
Domestic chip design software vendors embrace Huawei’s Tau Scaling Law, but analysts caution that breaking US dominance is far from easy
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Ann Caoin Shanghai
Published: 6:54pm, 12 Jun 2026Updated: 7:00pm, 12 Jun 2026
China’s
2026-06-12
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2026-06-12
South China Morning Post
Semiconductors
TechBig Tech
China’s chip design software firms back Huawei’s new scaling law. But can they catch US rivals?
Domestic chip design software vendors embrace Huawei’s Tau Scaling Law, but analysts caution that breaking US dominance is far from easy
3-MIN READ
8
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Make SCMP preferred on Google
Ann Caoin Shanghai
Published: 6:54pm, 12 Jun 2026Updated: 7:00pm, 12 Jun 2026
China’s c
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation
2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-11
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2026-06-11
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2026-06-11
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2026-06-11
Seeking Alpha
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