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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
www.newelectronics.co.uk
2026-06-04
New Electronics
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Neil Tyler
04 Jun 2026
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Reshaping the technology landscape in Europe
FAMES pilot line aims to strengthen Europe’s semiconductor capabilities
Siemens signs agreement to support European chip design initiative
European Chips Act 2.0 embraces a long-term industrial
2026-06-04
www.investing.com
2026-06-04
Investing.com
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2026-06-04
in.investing.com
2026-06-04
Investing.com India
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2026-06-04
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2026-06-04
Investing.com Canada
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2026-06-04
seekingalpha.com
2026-06-04
Seeking Alpha
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2026-06-04
simplywall.st
2026-06-04
simplywall.st
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2026-06-04
www.tradingkey.com
2026-06-04
TradingKey
SK Group Chairman Chey Tae-won and TSMC Chairman C.C. Wei agreed to expand cooperation in High Bandwidth Memory (HBM) and advanced packaging to meet AI technology trends. SK Hynix will integrate its HBM technology with TSMC's advanced packaging, both increasing capacity. The HBM market is projected to grow significantly, yet supply remains tight. This partnership aims to solidify SK Hynix's leader
2026-06-04
www.moomoo.com
2026-06-04
Moomoo
消息面上，随着英伟达等AI芯片功耗飙升，传统硅基电源架构已触及物理极限。行业正加速向800V高压直流(HVDC)架构过渡，碳化硅成为AI服务器固态变压器及电源管理的必选材料。英飞凌、意法半导体等巨头明确表示，AI数据中心的部署导致多款功率器件出现严重供应短缺。
公开资料显示，天岳先进在8英寸碳化硅衬底领域占据全球领先份额，12英寸完成样品研发、送样、小批量试样供货。据悉，天岳先进的12英寸SiC衬底进入台积电供应链验证阶段，作为下一代CoWoS中介层备选方案开展送样测试。用作替代硅中介层以解决高性能GPU的散热瓶颈。
Tianyue Advanced Materials (02631.HK) rose nearly 7% in early trading. As of the time of writing, it was up 3.27% at HK$104.1, with a tr
2026-06-04
news.futunn.com
2026-06-04
富途牛牛
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2026-06-04
www.digitimes.com
2026-06-04
digitimes
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim
2026-06-04
www.ktvb.com
2026-06-04
KTVB
LOCAL NEWS
Boise State University at center of new semiconductor workforce pipeline
The Pacific Intermountain Node for Semiconductor Education, or PINES, will connect universities, community colleges and industry partners to expand opportunities.
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semiengineering.com
2026-06-04
Liz Allan
Satellite constellations with extra onboard compute are several steps away from handlin...
2026-06-04
www.idahopress.com
2026-06-04
Idaho Press
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2026-06-04
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2026-06-04
TradingView
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2026-06-04
www.foreignpolicyjournal.com
2026-06-04
foreignpolicyjournal.com
Credit: CoreWeave
CoreWeave, Inc. (NASDAQ: CRWV) shares surged roughly 14% after the company announced it had become the first AI cloud provider to complete bring-up and full system-level validation of NVIDIA (NASDAQ: NVDA) Vera Rubin NVL72.
The Vera Rubin NVL72 platform combines 72 Rubin GPUs and 36 Vera CPUs connected through NVIDIA’s next-generation NVLink architecture, delivering better infe
2026-06-04
www.idahoednews.org
2026-06-04
Idaho Education News
America needs more workers in the microelectronics and semiconductor sectors — and soon.
By 2030, the shortage of workers could reach 157,000 nationally, according to a recent study.
Boise State University could play a regional and national role in addressing this shortfall, under a partnership announced Wednesday. Boise State will head a nine-state collaboration designed to draw students into h
2026-06-04
fortune.com
2026-06-04
Fortune
Nvidia has acquired Kumo AI, a small, four-year-old startup that develops foundation models designed to make accurate business predictions, according to two sources familiar with the deal.
Kumo’s three co-founders, Vanja Josifovski, Hema Raghavan, and Jure Leskovec, transitioned to Nvidia last month, the sources said. While the founders’ LinkedIn profiles have been updated, and now describe them
2026-06-04
www.semiconductor-today.com
2026-06-04
Semiconductor Today
Navitas collaborates with NVIDIA MGX Ecosystem to accelerate 800VDC AI infrastructure
On 29 May at the Taipei Nangang Exhibition Center, gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA participated in NVIDIA’s Partner Ceremony, which brought together key ecosystem partners supporting the NVIDIA AI Factory MGX platform, highl