Semiconductor News & Analysis Feed
1766 articles
2026-06-15
news.google.com
2026-06-15
AASTOCKS.com
2026-06-15
www.aastocks.com
2026-06-15
AASTOCKS.com
HBM HOLDINGS-B (02142.HK) +0.450 (+4.487%) Short selling $6.89M; Ratio 22.802% opened 1.99% higher today, reaching an intraday peak of HKD10.58. It is now trading at HKD10.54, up 5.08%, with turnover of 0.739 million shares, involving HKD7.7142 million.
Data
Last Update: 2026/06/15 10:26
HBM HOLDINGS-B
Cumulative performance
-13.82%
YTD
-18.19%
1-Month
Data
Last Update: 2026/06/1
2026-06-15
news.google.com
2026-06-15
AASTOCKS.com
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
www.thefastmode.com
2026-06-15
The Fast Mode
KKR, together with the Kuwait Investment Authority (KIA), NVIDIA and Vistra announced the launch of Helix Digital Infrastructure (Helix), a new company designed to deliver integrated infrastructure at the speed and scale required for hyperscalers to meet accelerating artificial intelligence (AI) demand.
As building AI infrastructure becomes increasingly complex, Helix will serve as a single coor
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology from Taiwan's PSMC, has also drawn a strategic partnership with Dutch lithography equipment supplier ASML.
2026-06-15
digitimes.com
2026-06-15
INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price increases. The company said it expected a gradual recovery in the second half of 2026 as industry inventories normalized and new products and customers began contributing. INPAQ also ou
2026-06-15
digitimes.com
2026-06-15
Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor equipment supplier's first manufacturing site in Malaysia.
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.
2026-06-15
digitimes.com
2026-06-15
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-15
digitimes.com
2026-06-15
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading a recovery that is both remarkable in scale and strikingly uneven in distribution. Of the 105 companies tracked, 69 reported positive accumulated year-over-year growth through May, but the top performers are lappi
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
www.tradingview.com
2026-06-15
TradingView
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Reuters
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Sunrise Energy Metals Agrees To Strategic Investment In Advanced Alscn Memory Semiconductor Developer Agni Semiconductor
Sunrise Energy Metals Agrees To Strategic Investment In Advanced Alscn Memory Semiconductor Developer Agni Semiconductor
RefinitivLess than 1 min read
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2026-06-15
www.digitaltrends.com
2026-06-15
Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors.
TSMC’s CoPoS packaging coul