Semiconductor News & Analysis Feed

Dublin, July 07, 2026 (GLOBE NEWSWIRE) -- The "Advanced Packaging Technologies Market Report 2026" has been added to ResearchAndMarkets.com's offering. The advanced packaging technologies market is experiencing significant growth, projected to expand from $8.03 billion in 2025 to $9.18 billion in 2026, at a CAGR of 14.2%. This growth is driven by complex semiconductor designs, demand for compac

This is a paid press release. Contact the press release distributor directly with any inquiries. Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics Research and Markets Tue, July 7, 2026 at 1:42 AM PDT 15 min read Company Logo Opportunities in advanced packaging arise from increasing semiconductor complexity, demand for compact ele

This is a paid press release. Contact the press release distributor directly with any enquiries. Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics Research and Markets Tue, 7 July 2026 at 1:42 am GMT-7 15 min read Company Logo Opportunities in advanced packaging arise from increasing semiconductor complexity, demand for compact el

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.

Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO Lip-Bu Tan to reorganize the company's foundry business.

Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, syste

www.communicationstoday.co.in Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a0d33c052e17d6c1 Performance and Security by Cloudflare Privacy

Read and get insights from specially curated unique stories from editorial Explore and discuss challenges & trends in India's leading B2B events Recognise work that not only stood out but was also purposeful Join leaders & experts for roundtables, conferences, panels and discussions By continuing you agree to our Privacy Policy & Terms & Conditions We have various options to advertise with us

By Wen-Yee Lee TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing ​customers to choose between the two approaches. “We’re ‌one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter

By Wen-Yee Lee TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing ​customers to choose between the two approaches. “We’re ‌one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter

__fail__

__fail__

__fail__

Home » Scaling Sustainable Manufacturing: The Economic Impact of Advanced Packaging Technologies Global enterprises face unprecedented regulatory scrutiny and mounting consumer demand for environmentally responsible operations. This paradigm shift fundamentally alters the economic calculus of global supply chains and manufacturing protocols. Achieving structural Environmental, Social, and Govern