Semiconductor News & Analysis Feed

2 articles
2026-06-11
www.automotivepowertraintechnologyinternational.com 2026-06-11 Automotive Powertrain Technology International
ROHM has unveiled the TSC3PAK (14.00 x 18.58 x 3.50mm) cooling package for SiC MOSFETs, which adopts a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, enabling automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliabi
2026-06-11
www.automotivepowertraintechnologyinternational.com 2026-06-11 Automotive Powertrain Technology International
Texas Instruments (TI) has launched a high-cell-count battery monitor with an integrated electrochemical impedance spectroscopy (EIS) engine, bringing predictive intelligence, comprehensive data and real-time diagnostics to battery monitoring in electric vehicles and energy storage system applications. The BQ79826Z-Q1 battery monitor enhances safety and extends battery life by detecting potential