Semiconductor News & Analysis Feed

Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Businessreported.

Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the world's two largest suppliers, Nittobo and Taiwan Glass, short of capacity. In particular, low coefficient of thermal expansion (CTE) and low Dk2 products remain the tightest, with supply-demand gaps now expected to last through 2027.

The NVIDIA CUDA Core Compute Libraries (CCCL) provides delightful and efficient abstractions for CUDA developers in C++ and Python. It features: Parallel algorithms – Host-launched algorithms including sort, scan and reduce that remove the need to write custom kernels for common operations  Cooperative algorithms – Device-side algorithms such as block-wide or warp-wide reductions or scans that si

AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board

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