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As AI models grow in size, hardware designers face new challenges: placing more memory closer to processors, reducing energy consumption in data movement, and managing rising power density in cooling systems. CEA-Leti’s Pascal Vivet emphasizes that 3D integration and chiplet-based architectures are

At the upcoming Leti Innovation Days 2026 in Grenoble, CEA-Leti CEO Sébastien Dauvé emphasized that the real bottleneck for AI's next phase is architectural rather than computational or data-related. As AI workloads grow in complexity, the focus must shift from simply adding more compute to efficien