Semiconductor News & Analysis Feed
5336 articles
2026-06-18
www.storyboard18.com
2026-06-18
Storyboard18
Apple is preparing to increase prices across its product portfolio as rising memory and storage chip costs put pressure on the company's margins, Chief Executive Officer Tim Cook said in an interview with The Wall Street Journal.
The planned price increase comes as technology companies compete for limited supplies of memory components, with demand from AI-focused data centres pushing costs higher
2026-06-18
www.gadgets360.com
2026-06-18
Gadgets 360
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2026-06-18
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2026-06-18
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2026-06-18
mediaselangor.com
2026-06-18
mediaselangor.com
CUPERTINO, June 17 — Apple plans to raise prices on its products to offset increasing memory and storage chip costs, its chief executive officer Tim Cook told the Wall Street Journal (WSJ) in an interview.
A surge in artificial intelligence (AI)-driven demand for data centres has forced consumer electronics companies into a fierce competition for dwindling supplies of the key components, driving
2026-06-18
www.ndtvprofit.com
2026-06-18
NDTV Profit
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2026-06-18
kalkine.com.au
2026-06-18
Kalkine
Highlights
dorsaVi shares rose 2.50% to AUD 0.041 on 18 June 2026, following the release of latest operational update.
The company finalised the design package for its first integrated RRAM-CMOS validation chip.
The chip was developed with NTU Singapore and ITRI Taiwan.
The program now moves toward tape-out and staged silicon implementation.
Key features include write-and-verify circuitry, Comput
2026-06-18
gulfnews.com
2026-06-18
Gulf News
Apple’s price hikes may trigger broader tech industry increases amid chip crisis
Apple Inc. plans to raise prices on its products to offset surging memory and storage chip costs, CEO Tim Cook told the Wall Street Journal, marking a rare move by the tech giant to pass semiconductor supply pressures directly to consumers amid a tightening global chip shortage.
The price increases are expected to h
2026-06-18
wccftech.com
2026-06-18
Wccftech
SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities.
The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters.
The HBM4E memory will play a
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
INFRASTRUCTURE
apple
memory chips
supply chain
ai hardware
Apple Signals Price Hikes Amid Memory Chip Shortage
11 sources
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June 18, 2026
6.9
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Photo: pymnts.com · rights & takedowns
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Apple plans to raise prices on its products to offset soaring memory and storage chip costs, CEO Tim Cook told The Wall Street Journal in an interview published June 17, 2026. Cook sa
2026-06-18
www.bizzbuzz.news
2026-06-18
BizzBuzz
Apple CEO Tim Cook tells WSJ that price hikes are "unavoidable" as AI-driven demand drains memory chip supplies. Here's what's behind the shortage and what it means for Apple's lineup.
Tim Cook Confirms It: iPhone Prices Are Going Up Because of a Global Chip Shortage
Get ready to pay more for your next Apple device. CEO Tim Cook has confirmed that Apple plans to raise prices across its product l
2026-06-18
www.digitimes.com
2026-06-18
digitimes
Samsung Foundry’s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay...
2026-06-18
www.newelectronics.co.uk
2026-06-18
New Electronics
www.newelectronics.co.uk
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2026-06-18
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2026-06-18
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2026-06-18
en.yna.co.kr
2026-06-18
Yonhap News Agency
SEOUL, June 18 (Yonhap) -- SK hynix Inc. said Thursday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, to major global customers, marking another step in the race to supply next-generation memory for artificial intelligence (AI) applications.
"The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM deve
2026-06-18
digitimes.com
2026-06-18
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.
2026-06-18
digitimes.com
2026-06-18
Taiwan's 2026 GDP growth is on track to exceed 10% as AI demand powers the island's economy, Minister of Economic Affairs Ming-hsin Kung said, adding that this level of growth may be achieved given current trends. He pointed to stronger-than-expected exports from the AI supply chain and traditional industries such as machinery.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.