Semiconductor News & Analysis Feed
25 articles
2026-07-07
digitimes.com
2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
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2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
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2026-06-30
digitimes.com
2026-06-30
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a re
2026-06-30
digitimes.com
2026-06-30
Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.
2026-06-29
www.digitimes.com
2026-06-29
digitimes
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang...
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2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.
2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-26
digitimes.com
2026-06-26
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-14
www.thelec.net
2026-06-14
thelec.net
Nvidia's AI data center network infrastructure. (Photo: Nvidia)
South Korean materials, components and equipment companies are gaining traction in the co-packaged optics (CPO) market.
According to industry sources on June 12, Korean optical communication-related companies including RF Materials and Sungho Electronics are supplying key CPO-related components and equipment to global companies.
CP
2026-06-13
digitimes.com
2026-06-13
Optical industry leaders Largan and Genius Electronic Optical (GSEO) have recently discussed progress in co-packaged optics (CPO), a key non-smartphone growth driver, and their strategies differ sharply. As customer demand and orders become clearer and more firmly secured, both companies have also turned markedly more confident, having taken a more cautious stance in prior quarters.
2026-06-11
digitimes.com
2026-06-11
Largan Precision is accelerating its push into CPO-related optical components, with chairman Adam Lin revealing that the company is building its first automated pilot line at a new Taiwan facility, scheduled to be ready before September 2026.
2026-06-11
digitimes.com
2026-06-11
Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future of AI networking, could face further delays as manufacturing yields remain inconsistent.
2026-06-10
digitimes.com
2026-06-10
Lens maker Largan Precision held its shareholders' meeting on June 9, where chairman Adam Lin, long known for his terse public remarks, appeared relaxed and offered unusually detailed views on the industry, technology, and Largan's own operations. His comments showed clear optimism toward the company's development of fiber array units (FAUs).
2026-06-09
digitimes.com
2026-06-09
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026. Its earlier investment in US silicon photonics firm Skorpios and the acquisition of Pingood Enterprise also form part of the group's co-packaged optics (CPO) strategy.
2026-06-09
semiengineering.com
2026-06-09
Anne Meixner
Scaling to tens of millions of CPO units per year requires the industry to first settle...
2026-06-07
digitimes.com
2026-06-07
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
2026-06-04
www.taipeitimes.com
2026-06-04
Taipei Times
Nvidia Corp has begun shipping next-generation co-packaged optics (CPO) switches developed with Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), as the US tech giant seeks to tackle data transmission and power consumption challenges in artificial intelligence (AI) data centers, a Nvidia executive said yesterday.
The company has begun shipping its new Spectrum-X CPO switch to select partners, Nv
2026-06-02
www.digitimes.com
2026-06-02
digitimes
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
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