Semiconductor News & Analysis Feed

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.

Recent market speculation suggests that Nvidia's ambitious transition to a native 800-volt direct-current (800VDC) architecture for AI data centers may be delayed by up to a year, pushing large-scale production and deployment beyond 2028. The reports also claim that major cloud service providers (CSPs) could postpone adoption of the technology.

As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain bottlenecks, with industry watchers saying the number of components that are currently in a severe shortage now far exceeds those that are not.

Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.