Semiconductor News & Analysis Feed
3985 articles
2026-06-16
www.uidaho.edu
2026-06-16
University of Idaho
2026-06-16
www.morningstar.com
2026-06-16
Morningstar
2026-06-16
www.bastillepost.com
2026-06-16
bastillepost.com
2026-06-16
www.caledonianrecord.com
2026-06-16
Caledonian Record
2026-06-16
www.bdtonline.com
2026-06-16
Bluefield Daily Telegraph
2026-06-16
www.joplinglobe.com
2026-06-16
The Joplin Globe
2026-06-16
www.mykxlg.com
2026-06-16
mykxlg.com
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
2026-06-16
www.marketscreener.com
2026-06-16
marketscreener.com
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
www.investing.com
2026-06-16
Investing.com