www.newelectronics.co.uk
2026-05-06
New Electronics
Organised by the School of Electrical and Electronic Engineering and supported by semiconductor firm EnSilica and a number of industry sponsors, the initiative used the Tiny Tapeout framework to deliver practical ASIC design experience. The approach, which uses a multi-project wafer (MPW) model, enables multiple designs to be manufactured together at reduced cost.According to organisers, the event