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CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era

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digitimes.com 2026-10-02

IC-Link Joins TSMC 3DFabric Alliance; Showcases CoWoS ASIC Co-Design at OIP Forum Today - Tech Times

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www.techtimes.com 2026-09-24

The IC-Link–TSMC 3DFabric Alliance partnership marks a structural shift in how European fabless design teams access advanced packaging. By becoming the first European-headquartered ASIC partner to simultaneously hold all three OIP alliance memberships, IC-Link collapses the traditional sequential ha

Advanced Packaging CoWoS SoIC TSMC 3DFabric Alliance ASIC Design Chip Co-Design 2.5D/3D Packaging

Interview: Advanced packaging shifts toward system-level co-design for AI

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digitimes.com 2026-09-19

Hardware-Software Co-Design In The AI Era

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semiengineering.com 2026-09-15

In the era of rapid AI advancement, hardware-software co-design is emerging as a critical trend in the semiconductor industry. While AI has already demonstrated significant potential in software development and is beginning to penetrate hardware design, achieving a fully integrated hardware-software

Hardware-Software Co-Design AI in Chip Design Integrated Hardware and Software Development Virtual Prototyping Continuous Integration RISC-V Architecture Chip Design Process Optimization EDA Tools

Co-Designing AI Models Using Speculative Decoding for Faster LLM Inference - NVIDIA Developer

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developer.nvidia.com 2026-09-03

NVIDIA's latest developer article explores the use of speculative decoding to accelerate large language model (LLM) inference. This technique leverages a small draft model to predict multiple tokens, which are then verified in parallel by a larger target model, reducing total decoding iterations. Th

AI Model Co-Design Large Language Models Speculative Decoding GPU Optimization LLM Inference Acceleration NVIDIA Technology Model Parallelism Compute-Intensive Tasks

Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design - digitimes

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www.digitimes.com 2026-08-24

Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design

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digitimes.com 2026-08-24

SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders - digitimes

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www.digitimes.com 2026-08-20

SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders

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digitimes.com 2026-08-20

[News] SK hynix Reportedly Builds Silicon Valley HBM Team to Boost Customer Co-Design With U.S. Big Tech - TrendForce

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www.trendforce.com 2026-08-19

Anthropic co-designing custom AI inference chips to bypass costly Nvidia GPUs — Samsung reported as manufacturing partner for Claude maker - Tom's Hardware

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news.google.com 2026-08-07

Chip design complexity drives Synopsys co-design approach in physical AI - SiliconANGLE

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siliconangle.com 2026-07-24

The rapid evolution of intelligent software-defined systems is pushing chip design into a new era of physical AI, where complexity outpaces traditional engineering methods. Synopsys' senior vice president Prith Banerjee highlights that modern chip design has become one of the most challenging tasks,

chip design physical AI co-design semiconductor industry AI chip EDA Synopsys Ansys

Scaling Agentic AI Factories Through Extreme Co-Design with NVIDIA BlueField - NVIDIA Developer

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developer.nvidia.com 2026-07-17

AI Model Co-Design: Hardware-Friendly LLM Design | NVIDIA Technical Blog - NVIDIA Developer

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developer.nvidia.com 2026-07-11

This article explores the co-design approach for large language models (LLMs) in the AI domain, emphasizing how model design can be aligned with hardware characteristics to enhance overall performance. It highlights that AI performance is determined by three key dimensions: accuracy, throughput, and

AI LLM Hardware-friendly design Performance optimization Model deployment Transformer architecture GPU performance Compute-intensive tasks

Samsung is using a co-design approach to optimize its next-gen 2nm chips - SamMobile

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www.sammobile.com 2026-07-01

Morgan Stanley raises Synopsys stock price target on co-design outlook - Investing.com

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www.investing.com 2026-05-28

Morgan Stanley raises Synopsys stock price target on co-design outlook - Investing.com Canada

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ca.investing.com 2026-05-28

Building for the Rising Complexity of Agentic Systems with Extreme Co-Design | NVIDIA Technical Blog - NVIDIA Developer

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developer.nvidia.com 2026-05-06

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