Semiconductor News & Analysis Feed
59 articles
2026-06-18
digitimes.com
2026-06-18
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the co
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
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2026-06-16
digitimes.com
2026-06-16
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-09
www.marketscreener.com
2026-06-09
marketscreener.com
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2026-06-09
www.astutegroup.com
2026-06-09
Astute Group
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2026-06-08
www.trendforce.com
2026-06-08
TrendForce
[News] Onsemi Reportedly Plans Up to 300 Job Cuts in Czech Plant as Low-cost Chinese SiC Competition Intensifies
2026-06-08 Semiconductors editor
News
Please note that this article cites information from e15, iROZHLAS, Central News Agency and Czech Semiconductor Centre.
Amid intensifying competition from Chinese players, Onsemi is reportedly under mounting pressure, with up to 300 job cu
2026-06-05
news.google.com
2026-06-05
Yahoo Finance
2026-06-05
news.google.com
2026-06-05
The Motley Fool
2026-06-04
news.google.com
2026-06-04
Yahoo Finance
2026-06-04
asia.nikkei.com
2026-06-04
Nikkei Asia
Chipmaker says it will not raise prices like 'memory chip guys' amid AI demand surge
TSMC Chairman and CEO C.C. Wei attends the company’s annual general meeting in Hsinchu, Taiwan, on June 4. (Photo by Ken Kobayashi)
HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co.'s Chairman and CEO C.C. Wei said it will take a long time for Elon Musk's plan to build massive, cutting-edge chip plants f
2026-06-02
www.engadget.com
2026-06-02
Engadget
News
Computing
Laptops
ASUS's NVIDIA RTX Spark laptops could give the MacBook Pro some competition
The 128GB of unified memory, RTX 5070-level graphics and 1,600-nit OLED display should appeal to creators.
by
Steve Dent
June 2, 2026 10:51 am EST
ASUS
ASUS was one of the launch customers for NVIDIA's new RTX Spark ARM "superchip" and it's laptops look like the most interesting ones for creator
2026-06-02
www.chosun.com
2026-06-02
조선일보
By Ahn Byeol
Published 2026.06.02. 18:00
Updated 2026.06.02. 18:15
NVIDIA CEO Jensen Huang enters the 'Korea Partners Night' event held at a seafood restaurant in downtown Taipei, Taiwan, on the afternoon of the 1st. /Courtesy of Kim Min-jae
The words of NVIDIA CEO Jensen Huang have sparked mixed reactions among South Korea’s semiconductor giants. The controversy began after the “Korea Partner N
2026-06-02
finance.yahoo.com
2026-06-02
Yahoo Finance
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2026-06-01
247wallst.com
2026-06-01
24/7 Wall St.
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2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
digitimes.com
2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.